Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALPL | P05186 | 2/20 | 0.42 |
| ▸ | ALPG | P10696 | 2/20 | 0.42 |
| ▸ | ALPI | P09923 | 1/20 | 0.42 |
| ▸ | PLAA | Q9Y263 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.42 |
| ▸ | HTT | P42858 | 1/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.42 |
| ▸ | GFER | P55789 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.39 |
| ▸ | NOS1 | P29475 | 1/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.37 |
| ▸ | MYC | P01106 | 1/20 | 0.36 |
| ▸ | NAMPT | P43490 | 1/20 | 0.36 |
| ▸ | CTSZ | Q9UBR2 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL442104 | 1.00 | ALPL (0.42) | ALPLALPGALPIPLAAALDH1A1 | |
| SCHEMBL31484734 | 1.00 | ALPL (0.42) | ALPLALPGALPIPLAAALDH1A1 | |
| SCHEMBL30438581 | 0.86 | ALPG (0.44) | ALPLALPGPLAAALDH1A1KDM4E | |
| SCHEMBL29045399 | 0.86 | ALPG (0.44) | ALPLALPGPLAAALDH1A1KDM4E | |
| SCHEMBL154797 | 0.85 | ESR1 (0.51) | ALPGPLAAALDH1A1KDM4EKMT2A | |
| SCHEMBL31484739 | 0.85 | ESR1 (0.51) | ALPGPLAAALDH1A1KDM4EKMT2A | |
| SCHEMBL29713435 | 0.85 | ESR1 (0.51) | ALPGPLAAALDH1A1KDM4EKMT2A | |
| SCHEMBL441418 | 0.85 | ESR1 (0.51) | ALPGPLAAALDH1A1KDM4EKMT2A | |
| SCHEMBL217674 | 0.81 | AGTR1 (0.43) | ALDH1A1 | |
| SCHEMBL346574 | 0.81 | AGTR1 (0.43) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112724867-B | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2023-01-10 | — | — | CN | claimed |
| CN-114479734-A | Insulating adhesive film, preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2022-05-13 | — | — | CN | claimed |
| CN-111925765-B | Epoxy resin composition and application thereof | 深圳先进电子材料国际创新研究院 | 2022-01-25 | — | — | CN | claimed |
| CN-112724867-A | Insulating adhesive film material and preparation method and application thereof | 深圳先进技术研究院 | 2021-04-30 | — | — | CN | claimed |
| CN-111763403-A | Liquid epoxy resin composition and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2020-10-13 | — | — | CN | claimed |
| US-20080261049-A1 | Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-10-23 | — | — | US | claimed |
| JP-2110128-A | — | — | None | — | — | JP | disclosed |
| CN-119307169-A | Curable composition, cured product, overcoat film for flexible wiring board, and method for producing flexible wiring board | 日保丽公司 | 2025-01-14 | — | — | CN | disclosed |
| EP-3395848-B1 | POLYURETHANE, CURABLE COMPOSITION, OVERCOAT FILM, AND FLEXIBLE WIRING BOARD AND PRODUCTION METHOD THEREFORE | NIPPON POLYTECH CORP (JP) | 2024-02-28 | — | — | EP | disclosed |
| CN-114080408-B | Cured product, overcoat film, and flexible wiring board | 日保丽公司 | 2023-08-25 | — | — | CN | disclosed |
| CN-114096579-B | Polyurethane and curable composition | 日保丽公司 | 2023-06-09 | — | — | CN | disclosed |
| CN-114479734-A | Insulating adhesive film, preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2022-05-13 | — | — | CN | disclosed |
| CN-114174355-A | Acrylic rubber, crosslinkable rubber composition, and cured rubber product | 电化株式会社 | 2022-03-11 | — | — | CN | disclosed |
| US-5500294-A | MODIFIED ACRYLONITRILE-BUTADIENE COPOLYMER | TOMOEGAWA PAPER CO., LTD. (JP) | 1996-03-19 | — | — | US | disclosed |
| US-5494757-A | BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN | TOMOEGAWA PAPER CO., LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| US-5446080-A | Piperazinylethylaminocarbonyl containing acrylonitrile-butadiene copolymer and bismaleimide compound | TOMOEGAWA PAPER CO., LTD. (JP) | 1995-08-29 | — | — | US | disclosed |
| EP-0651040-A1 | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-05-03 | — | — | EP | disclosed |
| EP-0649892-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| EP-0649893-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| JP-H02110128-A | POWDERED EPOXY RESIN COMPOSITION | NEW JAPAN CHEM CO LTD | 1990-04-23 | — | — | JP | disclosed |