Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HIF1A | Q16665 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | MGLL | Q99685 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | DPP4 | P27487 | 2/20 | 0.30 |
| ▸ | CA4 | P22748 | 1/20 | 0.30 |
| ▸ | CA6 | P23280 | 1/20 | 0.30 |
| ▸ | CA5A | P35218 | 1/20 | 0.30 |
| ▸ | CA7 | P43166 | 1/20 | 0.30 |
| ▸ | ENPP2 | Q13822 | 1/20 | 0.30 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetraphenylphosphonium SCHEMBL6567177 | 1.00 | HIF1A (0.41) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7172885 | 0.97 | HIF1A (0.39) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7179570 | 0.92 | HIF1A (0.36) | HIF1ATDP1TSHRCYP2D6 | |
| Tetraphenylphosphonium SCHEMBL7132231 | 0.88 | HIF1A (0.38) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7172888 | 0.88 | CA4 (0.39) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL29362652 | 0.87 | HIF1A (0.50) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL6469728 | 0.85 | UQCRB (0.38) | HIF1AMGLLHSD17B10CYP3A4TDP1 | |
| Tetraphenylphosphonium SCHEMBL49763 | 0.85 | HIF1A (0.39) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL2870352 | 0.84 | HIF1A (0.43) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL19921940 | 0.83 | HIF1A (0.47) | HIF1AMAPTHPGDSMN1; SMN2MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110423370-B | Prepreg containing quartz glass fiber and substrate containing quartz glass fiber | 信越化学工业株式会社 | 2023-06-23 | — | — | CN | disclosed |
| US-11639410-B2 | Heat-curable resin composition and uses thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-05-02 | — | — | US | disclosed |
| US-20230123048-A1 | CURABLE COMPOSITION AND ELECTRONIC DEVICE EMPLOYING THE SAME | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 2023-04-20 | — | — | US | disclosed |
| US-11046848-B2 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-20210189043-A1 | HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-06-24 | — | — | US | disclosed |
| US-11001704-B2 | — | — | 2021-05-11 | — | — | US | disclosed |
| US-10808102-B2 | Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-20 | — | — | US | disclosed |
| US-10793712-B2 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-10-06 | — | — | US | disclosed |
| US-10600707-B2 | Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-03-24 | — | — | US | disclosed |
| US-20200048454-A1 | HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-02-13 | — | — | US | disclosed |
| US-20200048455-A1 | HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-02-13 | — | — | US | disclosed |
| US-20190355638-A1 | HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-11-21 | — | — | US | disclosed |
| US-20190055377-A1 | THERMOSETTING EPOXY RESIN SHEET FOR ENCAPSULATING SEMICONDUCTOR, SEMICONDUCTOR EQUIPMENT, AND METHOD FOR MANUFACTURING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-02-21 | — | — | US | disclosed |
| EP-1260551-B1 | FLAME-RETARDANT EPOXY RESIN COMPOSITION AND LAMINATE MADE WITH THE SAME | NEC CORP (JP) | 2009-01-14 | — | — | EP | disclosed |
| US-6733880-B2 | HEAT RESISTANT THERMOPLASTIC RESIN, EPOXY RESIN AND TRIPHENOL CURING AGENT; RELIABLE LOW TEMPERATURES BONDING | HITACHI CHEMICAL CO., LTD. (JP) | 2004-05-11 | — | — | US | disclosed |
| US-6730402-B2 | MIXTURE OF EPOXY RESIN, PHENOLIC RESIN CURING AGENTS AND METAL HYDROXIDE | NEC CORPORATION (JP) | 2004-05-04 | — | — | US | disclosed |
| US-20030152776-A1 | Flame-retardant epoxy resin composition and laminate made with the same | NEC CORPORATION (JP) | 2003-08-14 | — | — | US | disclosed |
| US-20030062630-A1 | Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-03 | — | — | US | disclosed |
| EP-1260551-A1 | FLAME-RETARDANT EPOXY RESIN COMPOSITION AND LAMINATE MADE WITH THE SAME | NEC Corporation (JP) | 2002-11-27 | — | — | EP | disclosed |