Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HIF1A | Q16665 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | MGLL | Q99685 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | DPP4 | P27487 | 2/20 | 0.30 |
| ▸ | CA4 | P22748 | 1/20 | 0.30 |
| ▸ | CA6 | P23280 | 1/20 | 0.30 |
| ▸ | CA5A | P35218 | 1/20 | 0.30 |
| ▸ | CA7 | P43166 | 1/20 | 0.30 |
| ▸ | ENPP2 | Q13822 | 1/20 | 0.30 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetraphenylphosphonium SCHEMBL4428554 | 1.00 | HIF1A (0.41) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7172885 | 0.97 | HIF1A (0.39) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7179570 | 0.92 | HIF1A (0.36) | HIF1ATDP1TSHRCYP2D6 | |
| Tetraphenylphosphonium SCHEMBL7132231 | 0.88 | HIF1A (0.38) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL7172888 | 0.88 | CA4 (0.39) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL29362652 | 0.87 | HIF1A (0.50) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL6469728 | 0.85 | UQCRB (0.38) | HIF1AMGLLHSD17B10CYP3A4TDP1 | |
| Tetraphenylphosphonium SCHEMBL49763 | 0.85 | HIF1A (0.39) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL2870352 | 0.84 | HIF1A (0.43) | HIF1AMAPTHPGDSMN1; SMN2MGLL | |
| Tetraphenylphosphonium SCHEMBL19921940 | 0.83 | HIF1A (0.47) | HIF1AMAPTHPGDSMN1; SMN2MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116348530-A | Method for producing polysiloxane, composition containing polysiloxane, and molded body | 三菱瓦斯化学株式会社 | 2023-06-27 | — | — | CN | claimed |
| US-5412028-A | Blend of polybutylene terephthalate, core-shell polymer, epoxidized novolak, blow molding | LUCKY, LTD. (KR) | 1995-05-02 | — | — | US | claimed |
| CN-120192629-A | Resin composition | 味之素株式会社 | 2025-06-24 | — | — | CN | disclosed |
| CN-120134737-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120134736-A | Resin sheet with metal foil | 味之素株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-119978708-A | Resin sheet and method for producing same, method for producing circuit board, and resin composition | 味之素株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119993845-A | Method for manufacturing circuit board | 味之素株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-119923423-A | Polymerizable composition for optical material, method for producing same, and optical material | 三井化学株式会社 | 2025-05-02 | — | — | CN | disclosed |
| CN-113667302-B | Resin composition | 味之素株式会社 | 2025-04-29 | — | — | CN | disclosed |
| CN-119899528-A | Thermosetting maleimide resin composition | 信越化学工业株式会社 | 2025-04-29 | — | — | CN | disclosed |
| CN-119833408-A | Method for manufacturing semiconductor chip package | 味之素株式会社 | 2025-04-15 | — | — | CN | disclosed |
| CN-115315785-A | Sheet for manufacturing semiconductor device | 琳得科株式会社 | 2022-11-08 | — | — | CN | disclosed |
| CN-115210075-A | Method for manufacturing sheet for manufacturing semiconductor device | 琳得科株式会社 | 2022-10-18 | — | — | CN | disclosed |
| CN-114599755-A | Sheet for manufacturing semiconductor device, method for manufacturing same, and method for manufacturing semiconductor chip with film-like adhesive | 琳得科株式会社 | 2022-06-07 | — | — | CN | disclosed |
| CN-114586141-A | Sheet for manufacturing semiconductor device | 琳得科株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-112566975-A | Polypropylene composition with improved coatability | 北欧化工公司 | 2021-03-26 | — | — | CN | disclosed |
| EP-1454937-A2 | Epoxy resin curing agent, curable epoxy resin composition and cured products | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2004-09-08 | — | — | EP | disclosed |
| US-20040147715-A1 | Epoxy resin curing agent, curable epoxy resin composition and cured product | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2004-07-29 | — | — | US | disclosed |
| US-6177541-B1 | REACTING (A) TRIS-(2,3-EPOXYPROPYL) ISOCYANURATE CONTAINING FROM 10 TO 3,000 PPM OF HYDROLYZABLE CHLORINE AND (B) A CARBOXY ACID IN THE PRESENCE OF (C) AN ARYLPHOSPHINE AND/OR A PHOSPHONIUM SALT COMPRISING A NON-HALOGEN ANION | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2001-01-23 | — | — | US | disclosed |
| US-4151313-A | ACID AND ALKALI RESISTANCE | HITACHI, LTD. (JP) | 1979-04-24 | — | — | US | disclosed |