SCHEMBL4444648

SCHEMBL4444648

Nc1c(Cc2cccc(C(=O)O)c2N)cccc1C(=O)O

nearest known ligand 0.59

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
G6PD P11413 1/20 0.59
CASP7 P55210 1/20 0.59
CASP6 P55212 1/20 0.59
HMGB1 P09429 2/20 0.50
ABCB11 O95342 1/20 0.49
LMNA P02545 1/20 0.49
PTGS1 P23219 1/20 0.49
ADORA1 P30542 1/20 0.49
PTGS2 P35354 1/20 0.49
MMP2 P08253 1/20 0.48
ALDH1A1 P00352 1/20 0.46
ALOX15 P16050 1/20 0.46
TSHR P16473 1/20 0.46
FOLH1 Q04609 1/20 0.46
NAPRT Q6XQN6 1/20 0.42
CLCN2 P51788 1/20 0.42
AKR1C3 P42330 1/20 0.42
CXCL12 P48061 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30934865 1.00 G6PD (0.59) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL3361331 0.89 TSHR (0.57) G6PDCASP7CASP6HMGB1ALDH1A1
SCHEMBL11548850 0.88 ALDH1A1 (0.52) G6PDCASP7CASP6ALDH1A1TSHR
SCHEMBL808482 0.86 G6PD (0.57) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL5965437 0.86 G6PD (0.57) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL3844490 0.86 G6PD (0.57) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL30762619 0.86 G6PD (0.57) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL6241910 0.84 ABCB11 (0.62) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL27902532 0.84 G6PD (0.55) G6PDCASP7CASP6HMGB1ABCB11
SCHEMBL27965749 0.84 G6PD (0.55) G6PDCASP7CASP6HMGB1ABCB11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0362649-B1 Radiation-sensitive compositions and their use BASF AG (DE) 1994-03-02 EP claimed
US-5284734-A Insulating layers and printed circuits; precursors for polyimides and polyquinazolines BASF AKTIENGESELLSCHAFT (DE) 1994-02-08 US claimed
US-12131841-B2 Formulation for producing an insulating system, electrical machine and method for producing an insulating system INNOMOTICS GMBH (DE) 2024-10-29 US disclosed
US-20240191029-A1 HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED RESIN FILM, PREPREG, SUBSTRATE, ADHESIVE AND SEMICONDUCTOR ENCAPSULATION MATERIAL USING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-13 US disclosed
WO-2024063112-A1 RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT 積水化学工業株式会社 2024-03-28 WO disclosed
US-20240084075-A1 HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-03-14 US disclosed
WO-2023201005-A2 HYDROPHOBIC POLYMER AEROGELS AEROGEL TECHNOLOGIES, LLC (US) 2023-10-19 WO disclosed
WO-2022225699-A9 POLY(TETRAHYDROQUINAZOLINE) AND DERIVED CARBON AEROGELS THE CURATORS OF THE UNIVERSITY OF MISSOURI (US) 2023-03-23 WO disclosed
CN-110072905-B Curing agent for cold-curable epoxy resin adhesive having rapid curing properties SIKA技术股份公司 2022-08-30 CN disclosed
US-11424654-B2 Insulation, electrical machine, and method for producing the insulation SIEMENS AKTIENGESELLSCHAFT (DE) 2022-08-23 US disclosed
CN-110072906-B Epoxy resin adhesive with high compressive strength SIKA技术股份公司 2022-06-03 CN disclosed
EP-0571899-A1 Radiation-curable mixture and its' use for producing high temperature-resistant relief structures BASF Lacke + Farben Aktiengesellschaft (DE) 1993-12-01 EP disclosed
US-5112989-A Process for producing unsaturated mono and dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS LTD. (JP) 1992-05-12 US disclosed
US-5087550-A Polymer procursor and aryl-containing carbonyl compounds BASF AKTIENGESELLSCHAFT (DE) 1992-02-11 US disclosed
EP-0387381-A1 Process for producing unsaturated dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1990-09-19 EP disclosed
US-4786675-A HEAT AND MOISTURE RESISTANCE, IMPACT STRENGTH NIPPON ZEON CO., LTD. (JP) 1988-11-22 US disclosed
EP-0004356-B1 POLYURETHANES PREPARED WITH TETRAHYDROFURAN-ALKYLENE OXIDE POLYMERIZATES HAVING LOW OLIGOMERIC CYCLIC ETHER CONTENT, PROCESSES FOR PREPARING THE SAME, AND ARTICLES AND FIBERS OF THE POLYURETHANES E.I. DU PONT DE NEMOURS AND COMPANY (US) 1982-12-15 EP disclosed
US-4130510-A Curing of epoxy resin systems using halfester compounds containing aliphatic tertiary amino groups HITACHI CHEMICAL CO., LTD. (JP) 1978-12-19 US disclosed
US-4086215-A USEFUL IN PRODUCING PURE WATER FROM SALINE WATER TORAY INDUSTRIES, INC. (JA) 1978-04-25 US disclosed
US-3993625-A REVERSE OSMOSIS TORAY INDUSTRIES, INC. (JA) 1976-11-23 US disclosed