Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL448452

O=C1NC(=O)C12CC1C=CC2C1.O=S(=O)(O)C(F)(F)F

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6863599 0.86 CA2 (0.33)
SCHEMBL6254118 0.69 CYP2D6 (0.35)
Noreximide SCHEMBL4259008 0.64 ALDH1A1 (0.43)
Noreximide SCHEMBL28566634 0.64 ALDH1A1 (0.43)
SCHEMBL9705137 0.63 CYP2D6 (0.37)
Trifluoromethanesulfonic Acid SCHEMBL218096 0.60 CRBN (0.52)
SCHEMBL22946662 0.59 CYP2D6 (0.33)
Trifluoromethanesulfonic Acid SCHEMBL7641674 0.59
Trifluoromethanesulfonic Acid SCHEMBL27994269 0.58 TSHR (0.40)
Trifluoromethanesulfonic Acid SCHEMBL22283860 0.57 LMNA (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7045267-B2 Resist composition comprising photosensitive polymer having lactone in its backbone SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-05-16 US claimed
US-6962768-B2 Ether monomers and polymers having multi-ring structures, and photosensitive polymers and resist compositions obtained from the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-11-08 US claimed
US-6897005-B2 Photosensitive polymer including copolymer of alkyl vinyl ether and resist composition containing the same SAMSUNG ELECTRONICS, CO., LTD. (KR) 2005-05-24 US claimed
US-6800418-B2 ALLOWING DEVELOPMENT WITH CONVENTIONAL DEVELOPERS AND HAVING A HIGH TRANSMITTANCE AT A F2 EXCIMER LASER WAVELENGTH OF 157 NM, HYDROPHILICITY, ADHESION TO UNDERLAYER SAMSUNG ELECTRONICS (KR) 2004-10-05 US claimed
US-6787287-B2 LITHOGRAPHY CHARACTERISTICS WHEN USED AS PHOTORESIST MATERIAL SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-09-07 US claimed
US-20040170919-A1 Ether monomers and polymers having multi-ring structures, and photosensitive polymers and resist compositions obtained from the same SAMSUNG ELECTRONICS CO. LTD. (KR) 2004-09-02 US claimed
US-20040137363-A1 Photosensitive polymer including copolymer of alkyl vinyl ether and resist composition containing the same CHOI SANG-JUN (KR) 2004-07-15 US claimed
US-6713228-B2 UNSATURATED ETHER CONTAINING POLYMER SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-03-30 US claimed
US-6696217-B2 ACRYLATED ESTER POLYMER SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-24 US claimed
US-20040018442-A1 Resist composition comprising photosensitive polymer having lactone in its backbone YOON KWANG-SUB (KR) 2004-01-29 US claimed
US-6627382-B2 Includes perfluoro-2,2-dimethy-1,3-dioxole derivatives and vinyl derivatives; for F2 excimer laser SAMSUNG ELECTRONICS, CO., LTD. (KR) 2003-09-30 US claimed
US-20030157430-A1 Fluorine-containing photosensitive polymer having hydrate structure and resist composition comprising the same SAMSUNG ELECTRONICS CO., LTD. 2003-08-21 US claimed
US-6596459-B1 Photosensitive polymer having a main chain consisting of only norbornene-type alicyclic units SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-07-22 US claimed
US-6537727-B2 Improved dry etching resistance, adhesiveness to underlying material layers, line edge roughness of line patterns, contrast characteristics SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-03-25 US claimed
US-20020177067-A1 Fluoro-containing photosensitive polymer and photoresist composition containing the same SAMSUNG ELECTRONICS CO., LTD. 2002-11-28 US claimed
US-20020160303-A1 Ether monomers and polymers having multi-ring structures, and photosensitive polymers and resist compositions obtained from the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-31 US claimed
US-20020155379-A1 Photosensitive monomer, photosensitive polymer and chemically amplified resist composition comprising lactone group having acid-labile protecting group SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-24 US claimed
US-20020146642-A1 Photosensitive polymers and resist compositions comprising the photosensitive polymers SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-10 US claimed
US-20020042016-A1 Resist composition comprising photosensitive polymer having loctone in its backbone SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-04-11 US claimed
US-20010024763-A1 Photosensitive polymer including copolymer of alkyl vinyl ether and resist composition containing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-09-27 US claimed