Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL218096

O=C1CCC(=O)N1.O=S(=O)(O)C(F)(F)F

nearest known ligand 0.52

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CRBN Q96SW2 3/20 0.52
KIF11 P52732 4/20 0.33
ALDH1A1 P00352 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
PKM P14618 1/20 0.32
PKLR P30613 1/20 0.32
NPC1 O15118 1/20 0.30
MAPK13 O15264 1/20 0.30
MAPK12 P53778 1/20 0.30
MAPK11 Q15759 1/20 0.30
MAPK14 Q16539 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Succinimide SCHEMBL30302994 0.82 CRBN (0.69) CRBNPKMNPC1MAPK13MAPK12
Succinimide SCHEMBL27863987 0.82 CRBN (0.69) CRBNPKMNPC1MAPK13MAPK12
Succinimide SCHEMBL3700829 0.80 CRBN (0.41) CRBNPKMPKLR
Succinimide SCHEMBL8613393 0.79 CRBN (0.65) CRBNPKMNPC1MAPK13MAPK12
Succinimide SCHEMBL3689496 0.78 CA2 (0.40) CRBNPKMPKLR
Succinimide SCHEMBL216817 0.77 CRBN (0.61) CRBNALDH1A1L3MBTL1PKMNPC1
Succinimide SCHEMBL8613396 0.75 CRBN (0.58) CRBNALDH1A1PKMNPC1MAPK13
Succinimide SCHEMBL28449848 0.74 CRBN (0.65) CRBNKIF11NPC1MAPK13MAPK12
Trifluoroacetic Acid SCHEMBL1967871 0.73 CRBN (0.55) CRBNKIF11NPC1MAPK13MAPK12
Trifluoromethanesulfonic Acid SCHEMBL22283860 0.73 LMNA (0.32) ALDH1A1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6287747-B1 CONTAINING ORGANOOXYGEN COMPOUNDS AND UNSATURATED COMPOUNDS SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-09-11 US claimed
US-6143465-A Photosensitive polymer having cyclic backbone and resist composition comprising same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-11-07 US claimed
EP-0745633-B1 Si containing high molecular compound and photosensitive resin composition NEC CORP (JP) 2000-08-02 EP claimed
US-6080524-A Photosensitive polymer having cyclic backbone and resist composition comprising the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-06-27 US claimed
US-5723257-A POLYVINYLSILSESQUIOXANES OR OTHER POLYSILOXANES NEC CORPORATION (JP) 1998-03-03 US claimed
EP-0745633-A2 Si containing high molecular compound and photosensitive resin composition NEC CORPORATION (JP) 1996-12-04 EP claimed
WO-2026097702-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR PREPARING PATTERN, CURED PRODUCT, AND ELECTRONIC COMPONENT 江苏艾森半导体材料股份有限公司 2026-05-15 WO disclosed
CN-114942569-B Photosensitive polymer and resist composition containing the same OLAS有限公司 2025-05-02 CN disclosed
US-20230107659-A1 COMPOSITION, LIGHT SHIELDING FILM, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING CURED FILM FUJIFILM CORPORATION (JP) 2023-04-06 US disclosed
CN-114942569-A Photosensitive polymer and resist composition containing the same OLAS有限公司 2022-08-26 CN disclosed
CN-107544208-B Negative photosensitive resin composition, spacer, protective film and liquid crystal display element 奇美实业股份有限公司 2022-05-31 CN disclosed
US-20210155825-A1 HARD-MASK FORMING COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND COMPOUND AND RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-27 US disclosed
WO-2020204073-A1 COMPOSITION FOR CURED-FILM FORMATION, WAVELENGTH CONVERSION FILM, LIGHT-EMITTING DISPLAY ELEMENT, AND METHOD FOR FORMING WAVELENGTH CONVERSION FILM JSR株式会社 2020-10-08 WO disclosed
CN-1456580-A Photosensitive polymer and amplified chemical photoresist agent composition containing it SAMSUNG ELECTRONICS CO LTD (KR) 2003-11-19 CN disclosed
US-6245482-B1 HOMO- OR COPOLYMER CONTAINING BIS(TRIMETHYLSILYL)-2-PROPYL (METH)ACRYLATE UNITS; EXCIMER LASER PHOTOLITHOGRAPHY, DRY ETCHING RESISTANCE FOR A SHARP PHOTORESIST PATTERN AT HIGH ASPECT RATIO SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-06-12 US disclosed
EP-0745633-B1 Si containing high molecular compound and photosensitive resin composition NEC CORP (JP) 2000-08-02 EP disclosed
US-6080524-A Photosensitive polymer having cyclic backbone and resist composition comprising the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-06-27 US disclosed
US-6051362-A Silicon containing polymer and chemically amplified resist composition comprising the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-04-18 US disclosed
US-5723257-A POLYVINYLSILSESQUIOXANES OR OTHER POLYSILOXANES NEC CORPORATION (JP) 1998-03-03 US disclosed
EP-0745633-A2 Si containing high molecular compound and photosensitive resin composition NEC CORPORATION (JP) 1996-12-04 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20210155825-A1 HARD-MASK FORMING COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND COMPOUND AND RESIN RER1, SEM1, POP1 CRBN 716/4885KIF11 3410/4885ALDH1A1 2421/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.