SCHEMBL4551023

SCHEMBL4551023

O=C=Nc1ccc(Oc2ccc(S(=O)(=O)c3ccc(Oc4ccc(N=C=O)cc4)cc3)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 7/20 0.47
SMN1; SMN2 Q16637 6/20 0.47
ALDH1A1 P00352 4/20 0.44
PKM P14618 3/20 0.44
L3MBTL1 Q9Y468 2/20 0.42
TDP1 Q9NUW8 2/20 0.42
TSHR P16473 2/20 0.42
CYP3A4 P08684 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
LMNA P02545 4/20 0.40
MAPT P10636 2/20 0.40
NPC1 O15118 2/20 0.40
RAB9A P51151 2/20 0.40
MAPK1 P28482 2/20 0.40
TP53 P04637 1/20 0.40
XBP1 P17861 1/20 0.40
MDM2 Q00987 1/20 0.40
HSD17B10 Q99714 1/20 0.40
POLB P06746 2/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL278353 0.88 CYP3A4 (0.52) ALDH1A1PKMTDP1TSHRCYP3A4
SCHEMBL7180551 0.88 CYP3A4 (0.52) ALDH1A1PKMTDP1TSHRCYP3A4
SCHEMBL4551613 0.86 CYP3A4 (0.54) HTTALDH1A1TDP1TSHRCYP3A4
SCHEMBL50333 0.86 CYP3A4 (0.54) HTTALDH1A1TDP1TSHRCYP3A4
SCHEMBL4544188 0.86 CYP3A4 (0.54) HTTALDH1A1TDP1TSHRCYP3A4
SCHEMBL8341982 0.84 HTT (0.54) HTTSMN1; SMN2ALDH1A1PKML3MBTL1
SCHEMBL17576538 0.83 PKM (0.39) HTTSMN1; SMN2ALDH1A1PKMTDP1
SCHEMBL1415412 0.80 CYP3A4 (0.48) HTTALDH1A1TDP1TSHRCYP3A4
SCHEMBL19193390 0.79 GAA (0.61) HTTSMN1; SMN2ALDH1A1PKML3MBTL1
SCHEMBL14493735 0.79 CYP3A4 (0.47) HTTALDH1A1TDP1TSHRCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8466251-B2 Polyamide-imide resin insulating paint and insulation wire using same HITACHI MAGNET WIRE CORP. (JP) 2013-06-18 US claimed
CN-119552505-A Composition for producing porous film, method for producing porous film, and porous film 东京应化工业株式会社 2025-03-04 CN disclosed
CN-119503516-A Slitting machine and system for manufacturing porous imide resin film 东京应化工业株式会社 2025-02-25 CN disclosed
CN-119503513-A Winding device, film winding method, and method for producing porous imide resin film 东京应化工业株式会社 2025-02-25 CN disclosed
CN-107249720-B Method for purifying liquid, method for producing chemical liquid or cleaning liquid, filter medium, and filter device 东京应化工业株式会社 2025-01-10 CN disclosed
CN-118440497-A Composition for producing porous film, method for producing porous film, and porous film 东京应化工业株式会社 2024-08-06 CN disclosed
CN-117839447-A Porous film 东京应化工业株式会社 2024-04-09 CN disclosed
US-20240100482-A1 FILTERING DEVICE, PURIFICATION DEVICE, AND METHOD FOR MANUFACTURING CHEMICAL LIQUID FUJIFILM CORPORATION (JP) 2024-03-28 US disclosed
WO-2024062988-A1 RESIN FILM, SCRIBING DEVICE, AND SCRIBING METHOD 三星ダイヤモンド工業株式会社 2024-03-28 WO disclosed
EP-4327919-A1 POROUS FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-28 EP disclosed
US-20120318555-A1 POLYAMIDE-IMIDE RESIN INSULATING COATING MATERIAL, INSULATED WIRE AND COIL HITACHI CABLE, LTD. (JP) 2012-12-20 US disclosed
US-20090176961-A1 Polyamide-imide resin insulating paint and insulation wire using same HITACHI MAGNET WIRE CORP. 2009-07-09 US disclosed
US-20060089464-A1 Resin composition for optical use NITTO DENKO CORPORATION 2006-04-27 US disclosed
EP-1650238-A2 Polycarbodiimide compositions for optical use NITTO DENKO CORPORATION (JP) 2006-04-26 EP disclosed
US-20060084766-A1 Resin composition for optical use NITTO DENKO CORPORATION 2006-04-20 US disclosed
EP-1647561-A2 Polycarbodiimide compositions for optical use NITTO DENKO CORPORATION (JP) 2006-04-19 EP disclosed
US-20060022356-A1 Resin for optical-semiconductor element encapsulation NITTO DENKO CORPORATION 2006-02-02 US disclosed
EP-1621563-A1 Resin for optical-semiconductor element encapsulation NITTO DENKO CORPORATION (JP) 2006-02-01 EP disclosed
US-6001951-A Aromatic polycarbodiimide and film thereof NITTO DENKO CORPORATION (JP) 1999-12-14 US disclosed
EP-0915109-A1 Aromatic polycarbodiimide and film thereof NITTO DENKO CORPORATION (JP) 1999-05-12 EP disclosed