SCHEMBL455205

SCHEMBL455205

C=C(C)C(=O)OCc1ccc(OCC)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.49
MAPT P10636 4/20 0.49
NPC1 O15118 3/20 0.49
RAB9A P51151 3/20 0.49
LMNA P02545 3/20 0.49
TDP1 Q9NUW8 3/20 0.48
POLB P06746 2/20 0.48
APEX1 P27695 1/20 0.48
HTT P42858 1/20 0.48
SMN1; SMN2 Q16637 2/20 0.47
MAPK1 P28482 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
MEN1 O00255 1/20 0.46
CYP1A2 P05177 1/20 0.46
KMT2A Q03164 1/20 0.46
NQO1 P15559 1/20 0.45
PARP10 Q53GL7 1/20 0.45
KDM4E B2RXH2 1/20 0.44
SLC5A1 P13866 1/20 0.43
SLC5A2 P31639 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL254038 0.86 ALDH1A1 (0.50) ALDH1A1TDP1POLBAPEX1HTT
SCHEMBL10904059 0.85 POLB (0.44) ALDH1A1MAPTRAB9ATDP1POLB
SCHEMBL28756540 0.84 POLB (0.52) ALDH1A1MAPTTDP1POLBAPEX1
SCHEMBL453318 0.83 ALDH1A1 (0.53) ALDH1A1MAPTNPC1RAB9APOLB
SCHEMBL7918640 0.83 POLB (0.45) ALDH1A1MAPTNPC1RAB9ATDP1
SCHEMBL10720993 0.83 ALDH1A1 (0.44) ALDH1A1MAPTTDP1POLBAPEX1
SCHEMBL13034122 0.83 ALDH1A1 (0.60) ALDH1A1MAPTNPC1RAB9ALMNA
SCHEMBL19194552 0.82 ELANE (0.47) ALDH1A1MAPTLMNATDP1POLB
SCHEMBL10892441 0.82 SMN1; SMN2 (0.48) ALDH1A1NPC1RAB9ALMNATDP1
SCHEMBL19727703 0.82 GPR174 (0.45) MAPTNPC1RAB9ALMNATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120061626-A1 PASTE COMPOSITION USED FOR FORMING AN ELECTRODE OR WIRING WHICH IS CURABLE AT A LOW TEMPERATURE DONGJIN SEMICHEM CO., LTD (KR) 2012-03-15 US claimed
EP-2416328-A2 LOW TEMPERATURE FIREABLE PASTE COMPOSITION FOR FORMING AN ELECTRODE OR WIRING Dongjin Semichem Co., Ltd. (KR) 2012-02-08 EP claimed
WO-2025100122-A1 ELECTRODE PERIPHERAL EMBEDDING MATERIAL, PRE-BAKED FILM OF ELECTRODE PERIPHERAL EMBEDDING MATERIAL, METHOD FOR PRODUCING PRE-BAKED FILM OF ELECTRODE PERIPHERAL EMBEDDING MATERIAL, AND MICRO-LED DISPLAY ELEMENT 日産化学株式会社 2025-05-15 WO disclosed
WO-2025027810-A1 ELECTRODE PERIPHERAL EMBEDDED MATERIAL, ELECTRODE PERIPHERAL EMBEDDED MATERIAL PREBAKED FILM, METHOD FOR MANUFACTURING ELECTRODE PERIPHERAL EMBEDDED MATERIAL PREBAKED FILM, AND MICRO LED DISPLAY ELEMENT 日産化学株式会社 2025-02-06 WO disclosed
US-20170124922-A1 FLUORESCENT FLEX SHEET AND METHOD OF MANUFACTURING THE SAME GLLEPE CO., LTD. (KR) 2017-05-04 US disclosed
CN-104781353-B Fluorophor ink composite and preparation method thereof 金喜俊 2017-03-15 CN disclosed
CN-106488843-A Fluorescence flexible sheets and its manufacture method GLLEPE株式会社 2017-03-08 CN disclosed
US-9481779-B2 Fluorescent ink composition, and preparation method therefor KIM HEE JOON (KR) 2016-11-01 US disclosed
US-20150275056-A1 FLUORESCENT INK COMPOSITION, AND PREPARATION METHOD THEREFOR KIM HEE JOON (KR) 2015-10-01 US disclosed
CN-104781353-A Fluorescent ink composition, and preparation method therefor KIM HEE-JOON 2015-07-15 CN disclosed
CN-103261966-A Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board HITACHI CHEMICAL CO LTD 2013-08-21 CN disclosed
US-20130046087-A1 Substituted Cyclodextrin Derivatives Useful As Intermediates For Producing Biologically Active Materials ARCARIOS BV (NL) 2013-02-21 US disclosed
EP-2550299-A2 Substituted cyclodextrin derivatives and process for their preparation Arcarios B.V. (NL) 2013-01-30 EP disclosed
CN-102778815-A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board HITACHI CHEMICAL IND CO 2012-11-14 CN disclosed
US-20120061626-A1 PASTE COMPOSITION USED FOR FORMING AN ELECTRODE OR WIRING WHICH IS CURABLE AT A LOW TEMPERATURE DONGJIN SEMICHEM CO., LTD (KR) 2012-03-15 US disclosed
EP-2416328-A2 LOW TEMPERATURE FIREABLE PASTE COMPOSITION FOR FORMING AN ELECTRODE OR WIRING Dongjin Semichem Co., Ltd. (KR) 2012-02-08 EP disclosed
CN-102331684-A Photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board, and printed wiring board HITACHI CHEMICAL CO LTD 2012-01-25 CN disclosed
WO-2011117317-A2 SUBSTITUTED CYCLODEXTRIN DERIVATIVES USEFUL AS INTERMEDIATES FOR PRODUCING BIOLOGICALLY ACTIVE MATERIALS ARCARIOS BV (NL) 2011-09-29 WO disclosed
US-4761438-A ACRYLIC AMIDE COPOLYMERS HOYA CORPORATION (JP) 1988-08-02 US disclosed
US-4625009-A POLYMER OF N,N-DIMETHYLACRYLAMIDE, UNSATURATED CARBOXYLIC ACID, HYDROPHOBIC (METH)ACRYLATE ESTER, POLYALKYLENE GLYCOL DI(METH)ACRYLATE HOYA CORPORATION (JP) 1986-11-25 US disclosed