SCHEMBL4572006

SCHEMBL4572006

CCC(=O)OC1CCOC1=O

nearest known ligand 0.55

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 4/20 0.55
CYP1A2 P05177 2/20 0.55
CYP2C19 P33261 2/20 0.55
CYP2C9 P11712 1/20 0.55
KDM4E B2RXH2 3/20 0.52
ALDH1A1 P00352 2/20 0.52
HPGD P15428 1/20 0.52
HSD17B10 Q99714 1/20 0.52
POLB P06746 1/20 0.49
TSHR P16473 2/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
GAA P10253 1/20 0.45
NTSR1 P30989 1/20 0.41
ATM Q13315 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7747327 1.00 MAPK1 (0.55) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL14133307 0.87 ALDH1A1 (0.45) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7746309 0.86 MAPK1 (0.52) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7747599 0.86 MAPK1 (0.52) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL14302990 0.84 MAPK1 (0.52) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7749487 0.83 CYP1A2 (0.50) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7747633 0.83 CYP1A2 (0.50) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7742216 0.83 CYP1A2 (0.50) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7746326 0.83 MAPK1 (0.56) MAPK1CYP1A2CYP2C19CYP2C9KDM4E
SCHEMBL7747597 0.83 MAPK1 (0.56) MAPK1CYP1A2CYP2C19CYP2C9KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230152694-A1 PHOTORESIST COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-05-18 US disclosed
US-20230152694-A1 PHOTORESIST COMPOSITIONS AND METHODS OF FABRICATING A SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-05-18 US disclosed
US-20210047457-A1 COMPOUND, RESIN, COMPOSITION AND PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-02-18 US disclosed
US-10562991-B2 Developer, pattern forming method, and electronic device manufacturing method FUJIFILM CORPORATION (JP) 2020-02-18 US disclosed
US-10319735-B2 Method for manufacturing semiconductor device SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-06-11 US disclosed
US-20180186907-A1 DEVELOPER, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD FUJIFILM CORPORATION (JP) 2018-07-05 US disclosed
US-9897913-B2 Radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-02-20 US disclosed
US-20170186768-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2017-06-29 US disclosed
CN-105102390-A Method for manufacturing thin-walled glass substrate NISSAN CHEMICAL IND LTD 2015-11-25 CN disclosed
US-8968979-B2 Positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-03-03 US disclosed
US-7217498-B2 Multilayer; support with image forming layer containing water insoluble polymer and soluble in alkaline aqueous solutions FUJIFILM CORPORATION (JP) 2007-05-15 US disclosed
US-7217498-B2 Multilayer; support with image forming layer containing water insoluble polymer and soluble in alkaline aqueous solutions FUJIFILM CORPORATION (JP) 2007-05-15 US disclosed
US-7217501-B2 Infrared-sensitive lithographic printing plate FUJIFILM CORPORATION (JP) 2007-05-15 US disclosed
US-20070099120-A1 Developing solution for lithographic printing plate precursor and method for making lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2007-05-03 US disclosed
US-20070099120-A1 Developing solution for lithographic printing plate precursor and method for making lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2007-05-03 US disclosed
US-20070082289-A1 Photosensitive composition, pattern forming method using the photosensitive composition and compound for use in the photosensitive composition FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed
US-7189015-B2 Method for replenishing development replenisher in automatic developing machine for photosensitive lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2007-03-13 US disclosed
US-7189015-B2 Method for replenishing development replenisher in automatic developing machine for photosensitive lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2007-03-13 US disclosed
EP-1757980-A1 Radiation sensitive resin composition JSR Corporation (JP) 2007-02-28 EP disclosed
WO-2001018231-A2 METHOD FOR PRODUCING (R) OR (S)-HYDROXY-η-BUTYROLACTONE LONZA AG (CH) 2001-03-15 WO disclosed