SCHEMBL4582901

SCHEMBL4582901

CC(C)(C)Oc1ccc(C=CC=Cc2ccccc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.54
TRPA1 O75762 2/20 0.52
RELA Q04206 1/20 0.47
PPARA Q07869 4/20 0.46
PPARG P37231 3/20 0.46
ALDH1A1 P00352 3/20 0.42
LMNA P02545 3/20 0.42
RAB9A P51151 2/20 0.42
NPC1 O15118 2/20 0.42
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.42
MAPK1 P28482 2/20 0.42
ALOX5 P09917 1/20 0.42
CYP1A2 P05177 2/20 0.41
CYP3A4 P08684 2/20 0.41
MTOR P42345 2/20 0.41
THPO P40225 1/20 0.41
HIF1A Q16665 1/20 0.41
CYP1A1 P04798 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7541659 0.92 TRPA1 (0.61) TRPA1RELAPPARAPPARGALDH1A1
SCHEMBL7541661 0.92 TRPA1 (0.61) TRPA1RELAPPARAPPARGALDH1A1
SCHEMBL3329743 0.83 APP (0.57) MAOBTRPA1RELAPPARGALDH1A1
SCHEMBL9998062 0.81 ALDH1A1 (0.48) TRPA1RELAPPARAPPARGALDH1A1
Styrene SCHEMBL4582900 0.81 ALDH1A1 (0.54) TRPA1RELAPPARAPPARGALDH1A1
SCHEMBL7184445 0.81 ALDH1A1 (0.48) TRPA1RELAPPARAPPARGALDH1A1
SCHEMBL9998805 0.80 KMT2A (0.47) MAOBTRPA1RELAPPARAPPARG
SCHEMBL20390035 0.79 LMNA (0.56) TRPA1RELAPPARAPPARGALDH1A1
SCHEMBL8672323 0.78 TRPA1 (0.83) MAOBTRPA1RELAPPARGALDH1A1
SCHEMBL7606991 0.78 LMNA (0.59) TRPA1RELAPPARAPPARGALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7332254-B2 Positive photosensitive insulating resin composition, cured product thereof, and electronic component JSR CORPORATION (JP) 2008-02-19 US disclosed
US-20070042296-A1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRONIC COMPONENT JSR CORPORATION (JP) 2007-02-22 US disclosed