SCHEMBL4598394

SCHEMBL4598394

Oc1c(O)c(O)c(-c2ccccc2)c(O)c1O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE4B Q07343 4/20 0.56
PDE4A P27815 3/20 0.56
PDE4C Q08493 3/20 0.56
PDE4D Q08499 3/20 0.56
HDAC4 P56524 1/20 0.54
HDAC2 Q92769 1/20 0.54
HDAC8 Q9BY41 1/20 0.54
HDAC6 Q9UBN7 1/20 0.54
BCL2L1 Q07817 2/20 0.50
ALDH1A1 P00352 2/20 0.50
HPGD P15428 1/20 0.50
HSD17B10 Q99714 1/20 0.50
HNF4A P41235 1/20 0.48
MAPT P10636 2/20 0.48
LMNA P02545 2/20 0.48
HTT P42858 1/20 0.48
MMP3 P08254 1/20 0.48
BACE1 P56817 1/20 0.46
CRHBP P24387 1/20 0.44
CRHR2 Q13324 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19253312 0.91 HDAC4 (0.52) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL29001722 0.90 PDE4B (0.58) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL8644874 0.88 PDE4A (0.50) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL18466722 0.85 PDE4B (0.45) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL454643 0.85 PDE4B (0.54) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL1754108 0.84 PDE4B (0.52) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL25422278 0.84 PDE4B (0.48) PDE4BPDE4APDE4CPDE4DHDAC4
SCHEMBL19956058 0.84 PDE4B (0.54) PDE4BPDE4APDE4CPDE4DHDAC4
Biphenyl SCHEMBL23211153 0.83 ALDH1A1 (0.69) HDAC4HDAC2HDAC8HDAC6BCL2L1
SCHEMBL19956864 0.82 PDE4B (0.52) PDE4BPDE4APDE4CPDE4DHDAC4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119998398-A Aromatic polycarbonate resin composition and molded article thereof 帝人株式会社 2025-05-13 CN disclosed
CN-119948103-A Resin composition and molded article thereof 帝人株式会社 2025-05-06 CN disclosed
CN-119923444-A Thermoplastic resin composition and molded article comprising the same 帝人株式会社 2025-05-02 CN disclosed
CN-119365538-A Polycarbonate resin composition and molded article comprising the same 帝人株式会社 2025-01-24 CN disclosed
EP-3730638-B1 A SINTERED BODY DAINIPPON INK & CHEMICALS (JP) 2024-08-14 EP disclosed
CN-112689800-B Photosensitive resin composition for forming permanent film, cured film, electronic device, and method for producing same 住友电木株式会社 2024-07-30 CN disclosed
CN-117203255-A Polyurethane and moisture curable composition comprising the same H.B.富乐公司 2023-12-08 CN disclosed
CN-114072461-B Thermoplastic resin composition, molded article and product 三菱电机株式会社 2023-11-14 CN disclosed
CN-113383035-B Molding material comprising carbon fiber-reinforced polycarbonate resin composition 帝人株式会社 2023-08-01 CN disclosed
CN-113557270-B Impeller and resin composition thereof 帝人株式会社 2023-07-28 CN disclosed
WO-2006109185-A2 NANOCOMPOSITE PHOTORESIST COMPOSITION FOR IMAGING THICK FILMS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2006-10-19 WO disclosed
CN-1761915-A Photoresist composition for the formation of thick films AZ ELECTRONIC MATERIALS USA (US) 2006-04-19 CN disclosed
CN-1650232-A Photoresist compositions comprising acetals and ketals as solvents CLARIANT INT LTD (CH) 2005-08-03 CN disclosed
CN-1646628-A Novolak resin mixture and photosensitive composition comprising the same AZ ELECTRONIC MATERIALS JAPAN (JP) 2005-07-27 CN disclosed
EP-1497368-A1 NOVOLAK RESIN MIXTURES AND PHOTOSENSITIVE COMPOSITIONS COMPRISING THE SAME Clariant International Ltd. (CH) 2005-01-19 EP disclosed
WO-2003085045-A1 NOVOLAK RESIN MIXTURES AND PHOTOSENSITIVE COMPOSITIONS COMPRISING THE SAME CLARIANT INTERNATIONAL LTD (CH) 2003-10-16 WO disclosed
EP-0530148-B1 Positive photo resist with increased dissolving power and reduced crystallisation tendency as well as new tetra(hydroxyphenyl)alkane OLIN MICROELECTRONIC CHEM INC (US) 1998-12-23 EP disclosed
US-5554797-A ENHANCE PHOTOSENSITIVITY AND/OR RATE OF DEVELOPMENT OF PHOTORESISTS OCG MICROELECTRONIC MATERIALS, INC. (US) 1996-09-10 US disclosed
US-5296330-A Resolution, amorphous CIBA-GEIGY CORP. (US) 1994-03-22 US disclosed
EP-0530148-A1 Positive photo resist with increased dissolving power and reduced crystallisation tendency as well as new tetra(hydroxyphenyl)alkane OCG Microelectronic Materials Inc. (US) 1993-03-03 EP disclosed