SCHEMBL4602170

SCHEMBL4602170

C=CC(=O)SC(c1ccccc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 2/20 0.43
▸ TSHR P16473 2/20 0.43
▸ AKT1 P31749 1/20 0.42
▸ HTT P42858 1/20 0.41
▸ TGM2 P21980 1/20 0.38
▸ CYP1A2 P05177 1/20 0.38
▸ KIF11 P52732 8/20 0.37
▸ KMT2A Q03164 2/20 0.37
▸ MAPT P10636 1/20 0.35
▸ NPSR1 Q6W5P4 1/20 0.35
▸ DNMT1 P26358 1/20 0.35
▸ DAO P14920 1/20 0.34
▸ NAPRT Q6XQN6 1/20 0.34
▸ ALOX15 P16050 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22966169 0.76 CYP1A2 (0.44) CYP1A2KIF11KMT2AMAPTDNMT1
SCHEMBL27415070 0.72 KIF11 (0.45) CYP1A2KIF11KMT2AMAPT
SCHEMBL4602166 0.72 THRB (0.40) ALDH1A1TSHRAKT1HTTTGM2
SCHEMBL4599455 0.71 KIF11 (0.41) ALDH1A1CYP1A2KIF11KMT2AMAPT
SCHEMBL7156964 0.70 KIF11 (0.39) ALDH1A1TSHRCYP1A2KIF11ALOX15
SCHEMBL929816 0.69 KIF11 (0.41) CYP1A2KIF11DNMT1
SCHEMBL11102137 0.69 KIF11 (0.43) HTTKIF11KMT2AMAPTDNMT1
SCHEMBL11102133 0.69 KIF11 (0.43) HTTKIF11KMT2AMAPTDNMT1
SCHEMBL11102138 0.69 KIF11 (0.43) HTTKIF11KMT2AMAPTDNMT1
SCHEMBL330818 0.68 AKT1 (0.46) ALDH1A1TSHRAKT1HTTTGM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220176682-A1 INTERMEDIATE FILM FOR LAMINATED GLASS AND LAMINATED GLASS SEKISUI CHEMICAL CO., LTD. (JP) 2022-06-09 — — US disclosed
EP-3943291-A1 INTERMEDIATE FILM FOR LAMINATED GLASS, AND LAMINATED GLASS SEKISUI CHEMICAL CO., LTD. (JP) 2022-01-26 — — EP disclosed
US-9709952-B2 Photosensitive composition for volume hologram recording, photosensitive substrate for volume hologram recording, and volume hologram recorded medium DAI NIPPON PRINTING CO., LTD. (JP) 2017-07-18 — — US disclosed
EP-2889700-B1 PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM-RECORDED OBJECT DAINIPPON PRINTING CO LTD (JP) 2017-01-25 — — EP disclosed
US-20150212487-A1 PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM RECORDED MEDIUM DAI NIPPON PRINTING CO., LTD. 2015-07-30 — — US disclosed
EP-2889700-A1 PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, PHOTOSENSITIVE SUBSTRATE FOR VOLUME HOLOGRAM RECORDING, AND VOLUME HOLOGRAM-RECORDED OBJECT Dai Nippon Printing Co., Ltd. (JP) 2015-07-01 — — EP disclosed
US-7462653-B2 Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof TAIYO INK MANUFACTURING CO., LTD. (JP) 2008-12-09 — — US disclosed
EP-1624001-B1 PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME TAIYO INK MFG CO LTD (JP) 2008-04-16 — — EP disclosed
US-20060058412-A1 Monomer having a (meth)acryloyl group and thermosetting functional group; a photoreactive diluent having a weight-average molecular weight of not more than 700; photopolymerization initiator; viscosity of not more than 150 mPa*s at 25 degrees C.; solder resist pattern directly drawn on printed circuit TAIYO INK MFG. CO., LTD. (JP) 2006-03-16 — — US disclosed
EP-1624001-A1 PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME Taiyo Ink Manufacturing Co. Ltd (JP) 2006-02-08 — — EP disclosed
US-5702846-A COMPRISING CATIONIC POLYMERIZABLE COMPOUND, RADICAL POLYMERIZABLE COMPOUND, INITIATORS FOR BOTH, WHEREIN AT LEAST ONE POLYMERIZABLE COMPOUND CONTAINS SILOXANE GROUP NIPPON PAINT CO. LTD. (JP) 1997-12-30 — — US disclosed
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