SCHEMBL4604629

SCHEMBL4604629

O=C1C=CC(=O)N1c1cccc(Oc2ccccc2)c1N1C(=O)C=CC1=O

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.53
TLR9 Q9NR96 2/20 0.52
NR1H2 P55055 1/20 0.48
ALDH1A1 P00352 1/20 0.41
HSP90AA1 P07900 1/20 0.41
PKM P14618 1/20 0.41
CCR6 P51684 1/20 0.41
ATM Q13315 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
FAAH O00519 1/20 0.41
HTR1A P08908 1/20 0.41
SLC6A2 P23975 1/20 0.41
SLC6A4 P31645 1/20 0.41
SLC6A3 Q01959 1/20 0.41
TSHR P16473 1/20 0.40
LMNA P02545 1/20 0.40
GAA P10253 1/20 0.40
KMT2A Q03164 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2814012 0.88 MGLL (0.62) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL29754607 0.82 MGLL (0.65) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL31180001 0.81 MGLL (0.59) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL27798119 0.80 MGLL (0.46) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL31174389 0.78 MGLL (0.64) MGLLALDH1A1HSP90AA1PKMCCR6
SCHEMBL635306 0.78 TLR9 (0.68) MGLLTLR9ALDH1A1HSP90AA1PKM
SCHEMBL10769331 0.77 MGLL (0.73) MGLLTLR9ALDH1A1HSP90AA1PKM
SCHEMBL9320871 0.76 MGLL (0.71) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL27718158 0.75 MGLL (0.56) MGLLTLR9NR1H2ALDH1A1HSP90AA1
SCHEMBL2841573 0.75 MGLL (0.55) MGLLTLR9NR1H2ALDH1A1HSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1940936-A1 POLYMER COMPOSITION, METHOD, AND ARTICLE General Electric Company (US) 2008-07-09 EP disclosed
WO-2007044294-A1 POLYMER COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-04-19 WO disclosed
EP-0416429-A1 Thermosettable bismaleimide resins CYTEC TECHNOLOGY CORP. (US) 1991-03-13 EP disclosed
EP-0354500-A2 Thermosetting bismaleinimide molding masses BASF Aktiengesellschaft (DE) 1990-02-14 EP disclosed