Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Propylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.42 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.36 |
| ▸ | PKM | P14618 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.31 |
| ▸ | NAAA | Q02083 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ether SCHEMBL7144070 | 0.88 | TSHR (0.52) | TDP1TSHRSMN1; SMN2PKMALDH1A1 | |
| Ether SCHEMBL1903681 | 0.86 | TSHR (0.47) | TDP1TSHRSMN1; SMN2PKMALDH1A1 | |
| Propylene Glycol SCHEMBL243614 | 0.85 | TDP1 (0.41) | TDP1TSHRSMN1; SMN2ALDH1A1CYP3A4 | |
| Propylene Glycol SCHEMBL8605999 | 0.85 | TDP1 (0.41) | TDP1TSHRSMN1; SMN2ALDH1A1CYP3A4 | |
| Propylene Glycol SCHEMBL3669314 | 0.84 | TSHR (0.44) | TDP1TSHRSMN1; SMN2ALDH1A1CYP3A4 | |
| Ether SCHEMBL9617742 | 0.83 | TSHR (0.50) | TDP1TSHRSMN1; SMN2PKMALDH1A1 | |
| Ethyl Propionate SCHEMBL104601 | 0.83 | MGAM (0.43) | TDP1TSHRALDH1A1MAPTNAAA | |
| Ether SCHEMBL6862110 | 0.81 | TDP1 (0.39) | TDP1TSHRSMN1; SMN2ALDH1A1NPSR1 | |
| Propylene Glycol SCHEMBL3670673 | 0.81 | THRB (0.47) | TDP1TSHRSMN1; SMN2ALDH1A1CYP3A4 | |
| SCHEMBL27849530 | 0.81 | TSHR (0.49) | TDP1TSHRSMN1; SMN2PKMALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115291472-A | Negative photoresist composition and spacer formed therefrom | 漳州思美科新材料有限公司 | 2022-11-04 | — | — | CN | claimed |
| CN-115167078-A | Positive photoresist composition, cured film and synthesis method thereof | 漳州思美科新材料有限公司 | 2022-10-11 | — | — | CN | claimed |
| CN-104007616-B | Photosensitive resin composition and display device using the same | 三星显示有限公司 | 2022-01-28 | — | — | CN | claimed |
| CN-106896644-B | Photosensitive resin composition and application thereof | 青岛蓝帆新材料有限公司 | 2020-05-08 | — | — | CN | claimed |
| CN-106909024-B | Photosensitive resin composition and application thereof | 辽宁靖帆新材料有限公司 | 2020-03-13 | — | — | CN | claimed |
| US-20140240645-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY DEVICE USING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-08-28 | — | — | US | claimed |
| US-8492459-B2 | Ink composition and method of forming a pattern using the same | LG DISPLAY CO., LTD. (KR) | 2013-07-23 | — | — | US | claimed |
| US-20120064455-A1 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME | SAMSUNG TECHWIN CO., LTD. (KR) | 2012-03-15 | — | — | US | claimed |
| US-20090176936-A1 | Ink composition and method of forming a pattern using the same | LG DISPLAY CO., LTD. (KR) | 2009-07-09 | — | — | US | claimed |
| JP-8179500-A | — | — | None | — | — | JP | disclosed |
| JP-8195337-A | — | — | None | — | — | JP | disclosed |
| JP-8179499-A | — | — | None | — | — | JP | disclosed |
| WO-2024147537-A1 | RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE | 동우 화인켐 주식회사 | 2024-07-11 | — | — | WO | disclosed |
| CN-111240157-B | Positive photosensitive resin composition and cured film prepared therefrom | 罗门哈斯电子材料韩国有限公司 | 2024-07-09 | — | — | CN | disclosed |
| US-6379860-B1 | RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE | FUJI PHOTO FILM CO., LTD. (JP) | 2002-04-30 | — | — | US | disclosed |
| EP-1193557-A1 | Use of a radiation sensitive resin composition for the formation of cathode separator, cathode separator and electroluminescent display device | JSR Corporation (JP) | 2002-04-03 | — | — | EP | disclosed |
| EP-1057859-A2 | Radiation sensitive resin composition and use of the same in an interlaminar insulating film | JSR Corporation (JP) | 2000-12-06 | — | — | EP | disclosed |
| JP-H08195337-A | SOLVENT FOR CLEANING AND REMOVING RESIST | FUJI PHOTO FILM CO LTD | 1996-07-30 | — | — | JP | disclosed |
| JP-H08179499-A | POSITIVE TYPE RESIST SOLUTION | JAPAN SYNTHETIC RUBBER CO LTD | 1996-07-12 | — | — | JP | disclosed |
| JP-H08179500-A | CHEMICAL AMPLIFICATION TYPE RESIST SOLUTION | JAPAN SYNTHETIC RUBBER CO LTD | 1996-07-12 | — | — | JP | disclosed |