SCHEMBL461323

SCHEMBL461323

Nc1ccccc1Oc1ccccc1S(=O)(=O)c1ccccc1Oc1ccccc1N

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.59
HTR6 P50406 2/20 0.47
KDM4E B2RXH2 1/20 0.47
MAPT P10636 1/20 0.47
CRHBP P24387 1/20 0.47
CRHR2 Q13324 1/20 0.47
CA9 Q16790 3/20 0.47
CYP2C9 P11712 2/20 0.47
CA12 O43570 2/20 0.47
CA1 P00915 2/20 0.47
CA2 P00918 2/20 0.47
CA4 P22748 2/20 0.47
CA6 P23280 1/20 0.47
CA5A P35218 1/20 0.47
CA7 P43166 1/20 0.47
CA14 Q9ULX7 1/20 0.47
CA5B Q9Y2D0 1/20 0.47
ALDH1A1 P00352 4/20 0.43
ADRA2B P18089 1/20 0.43
PTGS1 P23219 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29913887 1.00 GAA (0.59) GAAHTR6KDM4EMAPTCRHBP
Ammonia Solution, Strong SCHEMBL23003834 0.98 GAA (0.57) GAAHTR6KDM4EMAPTCRHBP
SCHEMBL10342789 0.89 HTR6 (0.65) GAAHTR6KDM4EMAPTCRHBP
SCHEMBL2105509 0.85 GAA (0.52) GAAHTR6KDM4EMAPTCRHBP
SCHEMBL1341030 0.85 ALDH1A1 (0.45) GAAHTR6KDM4EMAPTCRHBP
SCHEMBL6735351 0.84 GAA (0.50) GAAHTR6KDM4EMAPTCRHBP
SCHEMBL6741095 0.80 GAA (0.46) GAAHTR6CA9CYP2C9CA12
SCHEMBL30979203 0.80 KDM4E (0.65) GAAKDM4EMAPTCRHBPCRHR2
SCHEMBL29508342 0.80 KDM4E (0.65) GAAKDM4EMAPTCRHBPCRHR2
SCHEMBL81185 0.80 KDM4E (0.65) GAAKDM4EMAPTCRHBPCRHR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 208 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12091508-B2 Polyimides for temporary bonding adhesives, methods for manufacturing of thermoplastic polyimide materials, and methods for thin wafer bonding using the same KANEKA AMERICAS HOLDING, INC. (US) 2024-09-17 US claimed
EP-2555053-B1 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-18 EP claimed
US-8945694-B2 Poly aryl ether ketone polymer blends SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2015-02-03 US claimed
EP-1670850-B1 POLYIMIDE SULFONES, METHOD AND ARTICLES MADE THEREFROM SABIC INNOVATIVE PLASTICS IP (NL) 2013-05-08 EP claimed
EP-2555053-A1 Positive-type photosensitive resin composition Toray Industries, Inc. (JP) 2013-02-06 EP claimed
US-7153631-B2 Pattern-forming process using photosensitive resin composition HITACHI CHEMICAL CO., LTD. (JP) 2006-12-26 US claimed
US-20060194070-A1 Polyetherimide film and multilayer structure CITIBANK, N.A., AS COLLATERAL AGENT 2006-08-31 US claimed
EP-1670850-A1 POLYIMIDE SULFONES, METHOD AND ARTICLES MADE THEREFROM GENERAL ELECTRIC COMPANY (US) 2006-06-21 EP claimed
US-7041773-B2 Polyimide sulfones, method and articles made therefrom GENERAL ELECTRIC COMPANY (US) 2006-05-09 US claimed
WO-2005030839-A1 POLYIMIDE SULFONES, METHOD AND ARTICLES MADE THEREFROM GENERAL ELECTRIC COMPANY (US) 2005-04-07 WO claimed
EP-0538850-B1 New polyurea resins and their preparation and use IHARA CHEMICAL IND CO (JP) 1997-01-22 EP claimed
US-5319058-A Improved heat resistance when polyisocyanate component is a combination of an aliphatic diisocyanate and a cyclic trimer of an aliphatic polyisocyanate IHARA CHEMICAL INDUSTRY CO., LTD. (JP) 1994-06-07 US claimed
EP-0390992-B1 Aromatic polyimide double layered hollow filamentary membrane and process for producing same UBE INDUSTRIES (JP) 1994-06-01 EP claimed
US-5292963-A Continuous, polyimide separating membrane UBE INDUSTRIES, LTD. (JP) 1994-03-08 US claimed
US-5241018-A Shaped articles for air- and spacecraft UBE INDUSTRIES, LTD. (JP) 1993-08-31 US claimed
EP-0538850-A2 New polyurea resins and their preparation and use IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) 1993-04-28 EP claimed
US-5136015-A Reacting an unsaturated bisimide and a lesser stoichiometric amount of diamine followed by a polyamine having 3 or more benzene rings MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1992-08-04 US claimed
US-5006411-A Surface treatment with corona or plasma discharge for increasing adhesiveness; dielectrics UBE INDUSTRIES, LTD. (JP) 1991-04-09 US claimed
US-4801506-A TREATMENT WITH ELECTRIC DISCHARGE, IMPROVED ADHESION UBE INDUSTRIES, LTD. (JP) 1989-01-31 US claimed
US-4696994-A Transparent aromatic polyimide UBE INDUSTRIES, LTD. (JP) 1987-09-29 US claimed