SCHEMBL4615965

SCHEMBL4615965

Cc1cccc(C(N)(N)c2ccccc2)c1C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 2/20 0.46
TRPA1 O75762 2/20 0.41
ATM Q13315 1/20 0.41
KIF11 P52732 1/20 0.41
GABRA1 P14867 1/20 0.36
GABRB2 P47870 1/20 0.36
TSHR P16473 1/20 0.36
ACHE P22303 1/20 0.36
TAAR1 Q96RJ0 1/20 0.34
CYP3A4 P08684 2/20 0.33
TDP1 Q9NUW8 2/20 0.33
CYP1A2 P05177 2/20 0.33
CYP2D6 P10635 1/20 0.33
KMT2A Q03164 2/20 0.33
MEN1 O00255 1/20 0.33
AKR1B10 O60218 1/20 0.33
ABCB11 O95342 1/20 0.33
DHFR P00374 1/20 0.33
LMNA P02545 1/20 0.33
MPO P05164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2780246 0.85 KCNN4 (0.46) KCNN4KIF11GABRA1GABRB2TSHR
SCHEMBL1618598 0.84 KCNN4 (0.43) KCNN4TRPA1ATMKIF11GABRA1
Water SCHEMBL3190735 0.82 KCNN4 (0.41) KCNN4TRPA1ATMKIF11GABRA1
Iodide SCHEMBL1618290 0.82 KCNN4 (0.41) KCNN4TRPA1ATMKIF11GABRA1
SCHEMBL9154104 0.82 CD44 (0.45) KCNN4KIF11GABRA1GABRB2TSHR
SCHEMBL5598485 0.79 ESR1 (0.44) KCNN4TRPA1ATMKIF11GABRA1
SCHEMBL3740131 0.79 ESR1 (0.42) KCNN4TRPA1ATMKIF11GABRA1
SCHEMBL11524886 0.79 TRPA1 (0.41) KCNN4TRPA1ATMKIF11GABRA1
SCHEMBL17336269 0.78 KCNN4 (0.57) KCNN4TRPA1ATMKIF11GABRA1
SCHEMBL31140137 0.78 TRPA1 (0.45) KCNN4TRPA1ATMKIF11GABRA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119717092-A Light control film and preparation method thereof 东莞市超智新材料有限公司 2025-03-28 CN claimed
CN-113801492-B Wave-absorbing composite foam material and preparation method thereof 湖南兆恒材料科技有限公司 2023-08-25 CN claimed
CN-110885443-B Thermoplastic polyimide and preparation method thereof 万华化学集团股份有限公司 2022-04-22 CN claimed
CN-109627763-B Method for preparing polyimide molding powder by solid-phase polymerization 万华化学集团股份有限公司 2022-02-18 CN claimed
CN-113801492-A Wave-absorbing composite foam material and preparation method thereof 湖南兆恒材料科技有限公司 2021-12-17 CN claimed
CN-112123881-B Peep-proof membrane and preparation method thereof 深圳凯茵思科技有限公司 2021-07-27 CN claimed
CN-112210339-A Preparation method of heat-resistant high-strength steel gum 安徽瑞荣汽车零部件有限公司 2021-01-12 CN claimed
CN-112123881-A Peep-proof membrane and preparation method thereof 深圳凯茵思科技有限公司 2020-12-25 CN claimed
CN-110885443-A Thermoplastic polyimide and preparation method thereof 万华化学集团股份有限公司 2020-03-17 CN claimed
CN-105906809-B A kind of preparation method of polyimides 万华化学集团股份有限公司 2018-12-07 CN claimed
CN-108929438-A A kind of preparation method of polyamic acid and the method that polyimides is prepared by the polyamic acid 万华化学集团股份有限公司 2018-12-04 CN claimed
CN-104070748-B Frosted diaphragm and preparation method thereof DONGGUAN NALI OPTICAL MATERIAL CO., LTD. (CN) 2016-05-11 CN claimed
CN-104496828-A N,N-dialkylaniline self-assembly synthesis method for 4, 4'-diamino diphenyl methane derivative UNIV CHONGQING 2015-04-08 CN claimed
CN-104070748-A Frosted protective film and preparation method thereof DONGGUAN NALIFILM OPTICAL MATERIAL CO LTD 2014-10-01 CN claimed
EP-1694478-B1 WOOD-TREATMENT METHOD COMPRISING IN SITU POLYMERISATION UNDER ELECTROMAGNETIC RADIATION HENRI SELMER PARIS (FR) 2008-03-05 EP claimed
JP-2007513807-A 2007-05-31 JP claimed
EP-1694478-A1 WOOD-TREATMENT METHOD COMPRISING IN SITU POLYMERISATION UNDER ELECTROMAGNETIC RADIATION Henri Selmer Paris (FR) 2006-08-30 EP claimed
WO-2005065901-A1 WOOD-TREATMENT METHOD COMPRISING IN SITU POLYMERISATION UNDER ELECTROMAGNETIC RADIATION HENRI SELMER PARIS (FR) 2005-07-21 WO claimed
CN-118956309-A Underfill adhesive, and preparation method and application thereof 韦尔通科技股份有限公司 2024-11-15 CN disclosed
EP-0208654-A1 Reaction transfer moulding process and apparatus for the production of mouldings of thermosetting materials which may contain fillers and/or reinforcing materials CIBA-GEIGY AG (CH) 1987-01-14 EP disclosed