SCHEMBL46283

SCHEMBL46283

c1cc(C2CO2)cc(C2CO2)c1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.67
PARP1 P09874 1/20 0.59
ADRA2A P08913 3/20 0.40
DRD3 P35462 3/20 0.40
DRD2 P14416 1/20 0.40
CHRM2 P08172 1/20 0.40
CHRM4 P08173 1/20 0.40
CHRM1 P11229 1/20 0.40
CHRM3 P20309 1/20 0.40
GSTO1 P78417 1/20 0.38
HTR1A P08908 1/20 0.37
ALDH1A1 P00352 1/20 0.35
TP53 P04637 1/20 0.35
CYP3A4 P08684 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HIF1A Q16665 1/20 0.35
ADRA1A P35348 1/20 0.35
MEN1 O00255 1/20 0.34
CYP2C19 P33261 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21974861 1.00 TSHR (0.67) TSHRPARP1ADRA2ADRD3DRD2
SCHEMBL2080161 0.84 TSHR (0.54) TSHRPARP1MEN1KMT2A
SCHEMBL7779276 0.84 TSHR (0.54) TSHRPARP1CHRM2CHRM4CHRM1
SCHEMBL14216690 0.84 TSHR (0.54) TSHRPARP1ADRA2ADRD3DRD2
SCHEMBL937187 0.84 TSHR (0.54) TSHRPARP1MEN1KMT2A
SCHEMBL25261475 0.84 TSHR (0.54) TSHRPARP1ADRA2ADRD3DRD2
SCHEMBL10062055 0.84 DRD3 (0.59) TSHRPARP1DRD3DRD2ALDH1A1
SCHEMBL7784351 0.84 TSHR (0.54) TSHRPARP1DRD3DRD2ALDH1A1
SCHEMBL16412704 0.84 TSHR (0.54) TSHRPARP1
SCHEMBL14530029 0.84 PARP1 (0.55) TSHRPARP1ADRA2ADRD3DRD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 289 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118374249-B Epoxy resin suitable for chip packaging underfill, composition and use method thereof 络合高新材料(上海)有限公司 2024-09-20 CN claimed
CN-118374249-A Epoxy resin suitable for chip packaging underfill, composition and use method thereof 络合高新材料(上海)有限公司 2024-07-23 CN claimed
EP-4025555-A1 METHOD OF MAKING A DIALDEYHDE Eastman Chemical Company (US) 2022-07-13 EP claimed
EP-4025553-A1 A PROCESS TO MAKE AROMATIC ENOL ETHERS AND OLEFIN ISOMERS OF AROMATIC ENOL ETHERS Eastman Chemical Company (US) 2022-07-13 EP claimed
EP-4025554-A1 METHOD OF MAKING A DIALDEYHDE EASTMAN CHEMICAL COMPANY (US) 2022-07-13 EP claimed
WO-2022076356-A1 METHOD FOR MAKING A DIALDEHYDE EASTMAN CHEMICAL COMPANY (US) 2022-04-14 WO claimed
US-10865171-B1 Process to make aromatic enol ethers and olefin isomers of aromatic enol ethers EASTMAN CHEMICAL COMPANY (US) 2020-12-15 US claimed
US-10550057-B1 Method of making a dialdeyhde EASTMAN CHEMICAL COMPANY (US) 2020-02-04 US claimed
US-10544076-B1 Method of making a dialdeyhde EASTMAN CHEMICAL COMPANY (US) 2020-01-28 US claimed
CN-118374249-B Epoxy resin suitable for chip packaging underfill, composition and use method thereof 络合高新材料(上海)有限公司 2024-09-20 CN disclosed
CN-118374249-A Epoxy resin suitable for chip packaging underfill, composition and use method thereof 络合高新材料(上海)有限公司 2024-07-23 CN disclosed
US-20230322998-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY BLUE CUBE IP LLC 2023-10-12 US disclosed
US-20230322998-A1 PHOTO-CURABLE RESIN COMPOSITION FOR USE IN STEREOLITHOGRAPHY BLUE CUBE IP LLC 2023-10-12 US disclosed
EP-4025554-A1 METHOD OF MAKING A DIALDEYHDE EASTMAN CHEMICAL COMPANY (US) 2022-07-13 EP disclosed
WO-2010077484-A1 HYDROXYL-FUNCTIONAL POLYETHERS AND A PREPARATION PROCESS THEREFOR DOW GLOBAL TECHNOLOGIES INC. (US) 2010-07-08 WO disclosed
US-20100164368-A1 RADIATION- OR THERMALLY-CURABLE BARRIER SEALANTS NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CO (DE) 2010-07-01 US disclosed
US-20100164368-A1 RADIATION- OR THERMALLY-CURABLE BARRIER SEALANTS NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CO (DE) 2010-07-01 US disclosed
US-20100168279-A1 THERMALLY CURABLE EPOXY-AMINE BARRIER SEALANTS HENKEL AG & CO. KGAA (DE) 2010-07-01 US disclosed
US-20100168279-A1 THERMALLY CURABLE EPOXY-AMINE BARRIER SEALANTS HENKEL AG & CO. KGAA (DE) 2010-07-01 US disclosed
WO-2007111606-A1 RADIATION-OR THERMALLY-CURABLE BARRIER SEALANTS NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 2007-10-04 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10544076-B1 Method of making a dialdeyhde DERA, SORD, DDT TSHR 4670/4885PARP1 2026/4885ADRA2A 3271/4885
US-10865171-B1 Process to make aromatic enol ethers and olefin isomers of aromatic enol ethers ETV1, OSBPL8, ENY2 TSHR 3258/4885PARP1 4015/4885ADRA2A 215/4885
US-10550057-B1 Method of making a dialdeyhde ADH1C, DERA, DDT TSHR 4202/4885PARP1 1085/4885ADRA2A 2648/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.