SCHEMBL464972

SCHEMBL464972

O=C(O)c1cccc(Oc2ccc(C(=O)O)c(C(=O)O)c2)c1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.71
POLB P06746 3/20 0.69
KMO O15229 1/20 0.64
HPSE Q9Y251 1/20 0.62
KDM4E B2RXH2 1/20 0.59
TDP1 Q9NUW8 2/20 0.56
GALK1 P51570 1/20 0.56
CASP6 P55212 1/20 0.56
MCL1 Q07820 1/20 0.56
PLEC Q15149 1/20 0.56
NPC1 O15118 1/20 0.55
CYP2C9 P11712 1/20 0.55
RAB9A P51151 1/20 0.55
PYGM P11217 2/20 0.54
TNKS O95271 1/20 0.51
PARP15 Q460N3 1/20 0.51
PARP14 Q460N5 1/20 0.51
PARP10 Q53GL7 1/20 0.51
TNKS2 Q9H2K2 1/20 0.51
PARP2 Q9UGN5 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3080414 0.92 POLB (0.77) AKR1C3POLBKMOHPSEKDM4E
SCHEMBL29393214 0.89 POLB (0.67) AKR1C3POLBKMOHPSEKDM4E
SCHEMBL7637726 0.89 POLB (0.67) AKR1C3POLBKMOHPSEKDM4E
SCHEMBL140780 0.89 POLB (0.67) AKR1C3POLBKMOHPSEKDM4E
SCHEMBL3068910 0.87 POLB (0.85) AKR1C3POLBKMOHPSEKDM4E
SCHEMBL1042631 0.87 AKR1C3 (0.92) AKR1C3POLBKMOKDM4ENPC1
SCHEMBL30266789 0.87 AKR1C3 (0.92) AKR1C3POLBKMOKDM4ENPC1
SCHEMBL30449599 0.87 AKR1C3 (0.92) AKR1C3POLBKMOKDM4ENPC1
SCHEMBL30307454 0.87 AKR1C3 (0.92) AKR1C3POLBKMOKDM4ENPC1
SCHEMBL68858 0.87 AKR1C3 (0.92) AKR1C3POLBKMOKDM4ENPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105198737-B Rare earth-organic framework materials for the detection of high-temperature area fluorescence temperature and preparation method thereof 浙江大学 2017-03-08 CN claimed
CN-105198737-A Rare earth and organic frame material for detecting fluorescent temperature of high-temperature area and preparation method of rare earth and organic frame material UNIV ZHEJIANG 2015-12-30 CN claimed
US-4183835-A Salts of a basic nitrogenous compound as stabilizers for neutralized polyamide-acid resin NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1980-01-15 US claimed
WO-2023228815-A1 RESIN COMPOSITION, CURED PRODUCT, ANTENNA ELEMENT AND ELECTRONIC COMPONENT 東レ株式会社 2023-11-30 WO disclosed
US-11822243-B2 Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor TORAY INDUSTRIES, INC. (JP) 2023-11-21 US disclosed
WO-2023157839-A1 LAMINATE 東洋紡株式会社 2023-08-24 WO disclosed
EP-2919985-B1 COMPOSITE INSULATING FILM ELANTAS PDG INC (US) 2023-07-05 EP disclosed
CN-110392864-B Negative photosensitive resin composition, cured film, element and organic EL display having cured film, and method for producing same 东丽株式会社 2023-05-23 CN disclosed
WO-2023074536-A1 PROTECTIVE FILM-EQUIPPED LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM 東洋紡株式会社 2023-05-04 WO disclosed
US-11561470-B2 Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same TORAY INDUSTRIES, INC. (JP) 2023-01-24 US disclosed
WO-2023286685-A1 LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM 東洋紡株式会社 2023-01-19 WO disclosed
US-5053316-A THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-10-01 US disclosed
US-5043399-A Blend of acetal resin and transparent polyamide elastomer ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-08-27 US disclosed
EP-0409995-A1 VINYLIC RESIN COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1991-01-30 EP disclosed
EP-0348063-A1 Thermoplastic elastomer and photosensitive resin composition based thereon, and printing plate precursor comprising the composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-12-27 EP disclosed
EP-0235388-B1 PREPARATION PROCESS OF HEAT-RESISTANT POLYMERS MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-08 EP disclosed
US-4785069-A Preparation process of heat-resistant polymers from polycarboxylic acids or anhydrides in the presence of an alkali metal fluoride and quaternary onium salt MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-11-15 US disclosed
US-4736008-A Preparation process of heat-resistant polymers from polycarboxcylic acids and anhydrides in the presence of an alkali metal fluoride MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-04-05 US disclosed
EP-0235388-A2 Preparation process of heat-resistant polymers MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-09-09 EP disclosed
US-4183835-A Salts of a basic nitrogenous compound as stabilizers for neutralized polyamide-acid resin NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1980-01-15 US disclosed