SCHEMBL465422

SCHEMBL465422

O=C(O)c1cccc(-c2ccc(C(=O)O)c(C(=O)O)c2)c1

nearest known ligand 0.68

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
KMO O15229 2/20 0.66
RXRA P19793 2/20 0.58
RXRB P28702 2/20 0.58
PTPN11 Q06124 1/20 0.55
KDM4E B2RXH2 1/20 0.55
LMNA P02545 1/20 0.54
GAA P10253 1/20 0.54
ERN1 O75460 1/20 0.54
ACMSD Q8TDX5 3/20 0.53
HNF4A P41235 2/20 0.52
MCL1 Q07820 2/20 0.52
DHFR P00374 1/20 0.52
DDT P30046 1/20 0.51
KEAP1 Q14145 1/20 0.50
FOLH1 Q04609 1/20 0.50
DCLRE1A Q6PJP8 1/20 0.50
DCLRE1B Q9H816 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL21878438 0.98 KMO (0.63) KMORXRARXRBPTPN11KDM4E
SCHEMBL2188104 0.88 KMO (0.56) KMORXRARXRBPTPN11KDM4E
SCHEMBL30605782 0.88 ACMSD (0.66) KMOKDM4EACMSDHNF4AMCL1
SCHEMBL29395437 0.88 ACMSD (0.66) KMOKDM4EACMSDHNF4AMCL1
SCHEMBL1099041 0.88 ACMSD (0.66) KMOKDM4EACMSDHNF4AMCL1
SCHEMBL8999909 0.88 ACMSD (0.66) KMOKDM4EACMSDHNF4AMCL1
Ether SCHEMBL21878437 0.87 PTPN11 (0.59) KMORXRARXRBPTPN11LMNA
SCHEMBL16166057 0.87 ACMSD (0.61) KMORXRARXRBACMSDHNF4A
SCHEMBL28222622 0.86 KDM4E (0.60) KMOPTPN11KDM4EGAAACMSD
SCHEMBL14683877 0.86 KMO (0.87) KMORXRARXRBLMNAGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0409995-B1 VINYLIC RESIN COMPOSITION ASAHI CHEMICAL IND (JP) 1994-12-14 EP claimed
JP-9263697-A None JP disclosed
CN-115803957-B Diaphragm, electrical device comprising diaphragm and preparation method of diaphragm 宁德时代新能源科技股份有限公司 2024-10-22 CN disclosed
WO-2023281602-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE AND PRODUCT 三菱電機株式会社 2023-01-12 WO disclosed
CN-114006131-A Diaphragm, electronic device comprising diaphragm and preparation method of electronic device 宁德时代新能源科技股份有限公司 2022-02-01 CN disclosed
WO-2021065728-A1 ANTISTATIC AGENT, ANTISTATIC AGENT COMPOSITION CONTAINING SAME, ANTISTATIC RESIN COMPOSITION CONTAINING SAID AGENT AND SAID COMPOSITION, AND ARTICLE MOLDED THEREFROM 株式会社ADEKA 2021-04-08 WO disclosed
EP-3650481-A1 RESIN, RESIN COMPOSITION, NONWOVEN FABRIC USING SAME, FIBER PRODUCT, SEPARATOR, SECONDARY BATTERY, AND METHOD FOR PRODUCING ELECTRIC DOUBLE LAYER CAPACITOR AND NONWOVEN FABRIC Toray Industries, Inc. (JP) 2020-05-13 EP disclosed
US-20200131366-A1 RESIN, RESIN COMPOSITION, NONWOVEN FABRIC USING SAME, FIBER PRODUCT, SEPARATOR, SECONDARY BATTERY AND ELECTRIC DOUBLE LAYER CAPACITOR, AND METHOD FOR PRODUCING NONWOVEN FABRIC TORAY INDUSTRIES, INC. (JP) 2020-04-30 US disclosed
US-10301519-B2 Anti-static agent, anti-static agent composition, anti-static resin composition, and molding ADEKA CORPORATION (JP) 2019-05-28 US disclosed
US-20170267905-A1 ANTI-STATIC AGENT, ANTI-STATIC AGENT COMPOSITION, ANTI-STATIC RESIN COMPOSITION, AND MOLDING ADEKA CORPORATION (JP) 2017-09-21 US disclosed
JP-H09263697-A HEAT-RESISTANT RESIN COMPOSITION SUMITOMO BAKELITE CO LTD 1997-10-07 JP disclosed
US-5395870-A Styrene or acrylic polymer, polyamideimide elastomer, permanent antistatic property, molding materials ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1995-03-07 US disclosed
EP-0409995-B1 VINYLIC RESIN COMPOSITION ASAHI CHEMICAL IND (JP) 1994-12-14 EP disclosed
EP-0296636-B1 High purity crystals of biphenyltetracarboxylic dianhydride and process for their preparation UBE INDUSTRIES (JP) 1994-04-13 EP disclosed
EP-0348063-B1 THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1993-05-26 EP disclosed
US-5053316-A THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-10-01 US disclosed
US-5043399-A Blend of acetal resin and transparent polyamide elastomer ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-08-27 US disclosed
EP-0409995-A1 VINYLIC RESIN COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1991-01-30 EP disclosed
US-4958002-A BIPHENYLTETRACARBOXYLIC ACID DEHYDRATION; BY-PRODUCT INHIBITION UBE INDUSTRIES, LTD. (JP) 1990-09-18 US disclosed
EP-0348063-A1 Thermoplastic elastomer and photosensitive resin composition based thereon, and printing plate precursor comprising the composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-12-27 EP disclosed