SCHEMBL465470

SCHEMBL465470

CCCCC(O)N(CC)C(O)CCCC

nearest known ligand 0.37

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
DNM1 Q05193 2/20 0.36
FDPS P14324 1/20 0.36
CA2 P00918 3/20 0.34
MAPK1 P28482 1/20 0.34
GPR84 Q9NQS5 3/20 0.33
CA1 P00915 1/20 0.33
SPHK1 Q9NYA1 1/20 0.33
FFAR1 O14842 1/20 0.33
TDP1 Q9NUW8 1/20 0.32
LMNA P02545 1/20 0.32
ACHE P22303 1/20 0.31
BACE1 P56817 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL465359 0.92 GPR84 (0.41) FDPSGPR84SPHK1FFAR1LMNA
SCHEMBL27463510 0.86 GPR84 (0.38) FDPSGPR84SPHK1FFAR1LMNA
SCHEMBL4618928 0.84 ALDH1A1 (0.37) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL465377 0.83 TSHR (0.33) FDPSTDP1LMNA
SCHEMBL1548798 0.82 ALDH1A1 (0.36) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL465289 0.82 ALDH1A1 (0.36) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL9949589 0.81 ALDH1A1 (0.32) ALDH1A1DNM1FDPSCA2MAPK1
SCHEMBL5072154 0.80 DNM1 (0.44) ALDH1A1DNM1CA2GPR84CA1
SCHEMBL9950488 0.80 ALDH1A1 (0.31) ALDH1A1DNM1FDPS
SCHEMBL9950156 0.80 SPHK1 (0.32) ALDH1A1DNM1FDPSSPHK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10113049-B2 Thermoplastic resin composition NIPPON NYUKAZAI CO., LTD. (JP) 2018-10-30 US claimed
US-20150329698-A1 THERMOPLASTIC RESIN COMPOSITION NIPPON NYUKAZAI CO., LTD. (JP) 2015-11-19 US claimed
US-20080066644-A1 Alkylmines, alkanolamine compounds, surfactants, a coloring agent and a solvent; combination results in decreased kogation SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-20 US claimed
EP-1900785-A1 Ink Composition for Inkjet Recording Samsung Electronics Co., Ltd. (KR) 2008-03-19 EP claimed
US-10113049-B2 Thermoplastic resin composition NIPPON NYUKAZAI CO., LTD. (JP) 2018-10-30 US disclosed
US-20150344739-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD JSR CORPORATION (JP) 2015-12-03 US disclosed
US-20150329698-A1 THERMOPLASTIC RESIN COMPOSITION NIPPON NYUKAZAI CO., LTD. (JP) 2015-11-19 US disclosed
US-9080123-B2 Rust preventive oil composition JX NIPPON OIL & ENERGY CORPORATION (JP) 2015-07-14 US disclosed
US-8481652-B2 Thermoplastic polyamides having polyether amines BASF SE (DE) 2013-07-09 US disclosed
US-8404900-B2 Absorbents for separating acidic gases KOREA ELECTRIC POWER CORPORATION (KR) 2013-03-26 US disclosed
WO-2012007301-A3 FOAM ENHANCEMENT OF FATTY ACYL GLYCINATE SURFACTANTS UNILEVER PLC (GB) 2012-05-10 WO disclosed
EP-1394289-B1 RUST-PREVENTIVE OIL COMPOSITION NIPPON OIL CORP (JP) 2012-05-09 EP disclosed
WO-2010028975-A2 THERMALLY CONDUCTIVE POLYAMIDE HAVING INCREASED FLOW CAPABILITY BASF SE (DE) 2010-03-18 WO disclosed
WO-2009115535-A2 POLYAMIDE NANOCOMPOSITES WITH HYPER- BRANCHED POLYETHERAMINES BASF SE (DE) 2009-09-24 WO disclosed
WO-2009115536-A1 POLYAMIDE NANOCOMPOSITES WITH HYPER-BRANCHED POLYETHYLENIMINES BASF SE (DE) 2009-09-24 WO disclosed
WO-2009077492-A2 THERMOPLASTIC POLYAMIDES HAVING POLYETHER AMINES BASF SE (DE) 2009-06-25 WO disclosed
WO-2009050094-A1 THERMOPLASTIC POLYESTER MOLDING COMPOUNDS COMPRISING HIGHLY BRANCHED POLYETHER AMINES BASF SE (DE) 2009-04-23 WO disclosed
US-20080066644-A1 Alkylmines, alkanolamine compounds, surfactants, a coloring agent and a solvent; combination results in decreased kogation SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-20 US disclosed
EP-1900785-A1 Ink Composition for Inkjet Recording Samsung Electronics Co., Ltd. (KR) 2008-03-19 EP disclosed
EP-1394289-A1 RUST-PREVENTIVE OIL COMPOSITION Nippon Mitsubishi Oil Corporation (JP) 2004-03-03 EP disclosed