⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2236537 | 0.81 | KMT2A (0.32) | — | |
| SCHEMBL2238959 | 0.64 | ALDH1A1 (0.35) | — | |
| SCHEMBL2237386 | 0.64 | ALDH1A1 (0.35) | — | |
| SCHEMBL2237383 | 0.64 | ALDH1A1 (0.35) | — | |
| SCHEMBL17195994 | 0.63 | TLR4 (0.34) | — | |
| SCHEMBL16820322 | 0.62 | — | — | |
| SCHEMBL28915347 | 0.59 | CTRB1 (0.51) | — | |
| SCHEMBL2241169 | 0.59 | MAPT (0.33) | — | |
| SCHEMBL2356347 | 0.59 | MAPT (0.33) | — | |
| SCHEMBL788173 | 0.59 | CA1 (0.43) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 547 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025110618-A1 | LOW DIELECTRIC ADHESIVE COMPOSITION AND FLEXIBLE METAL LAMINATE USING SAME | 동우 화인켐 주식회사 | 2025-05-30 | — | — | WO | claimed |
| CN-114901752-B | UV resistant surfacing material for composite parts | 塞特工业公司 | 2024-06-07 | — | — | CN | claimed |
| CN-107266661-B | Curable resin composition and cured product thereof | 株式会社大赛璐 | 2022-09-02 | — | — | CN | claimed |
| CN-114901752-A | UV resistant surfacing material for composite parts | 塞特工业公司 | 2022-08-12 | — | — | CN | claimed |
| CN-110408006-B | Curing agent composition for thermosetting epoxy resin composition | 高新特殊工程塑料全球技术有限公司 | 2022-06-10 | — | — | CN | claimed |
| CN-111479889-B | Adhesive, laminate, battery packaging material, and battery | DIC株式会社 | 2022-06-07 | — | — | CN | claimed |
| US-20220077099-A1 | COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISING CURED PRODUCT THEREOF, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) | 2022-03-10 | — | — | US | claimed |
| EP-3560979-B1 | CURING AGENT COMPOSITIONS FOR THERMOSETTING EPOXY RESIN COMPOSITIONS | SHPP GLOBAL TECH BV (NL) | 2021-06-23 | — | — | EP | claimed |
| EP-3194466-B1 | TOUGHENING OF ANHYDRIDE CURED THERMOSETTING EPOXY POLYMERS USING GRAFTED TRIGLYCERIDES | UNIV DREXEL (US) | 2019-11-06 | — | — | EP | claimed |
| CN-110408006-A | Curing agent composition for thermosetting epoxy resin composition | SABIC GLOBAL TECHNOLOGIES BV | 2019-11-05 | — | — | CN | claimed |
| EP-3194466-A1 | TOUGHENING OF ANHYDRIDE CURED THERMOSETTING EPOXY POLYMERS USING GRAFTED TRIGLYCERIDES | Drexel University (US) | 2017-07-26 | — | — | EP | claimed |
| WO-2016040559-A1 | TOUGHENING OF ANHYDRIDE CURED THERMOSETTING EPOXY POLYMERS USING GRAFTED TRIGLYCERIDES | DREXEL UNIVERSITY (US) | 2016-03-17 | — | — | WO | claimed |
| US-20160075872-A1 | Toughening of Anhydride Cured Thermosetting Epoxy Polymers Using Grafted Triglycerides | DREXEL UNIVERSITY (US) | 2016-03-17 | — | — | US | claimed |
| WO-2014176217-A9 | BATTERY BINDER | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2014-12-24 | — | — | WO | claimed |
| CN-104238269-A | Photosensitive resin composition and application thereof | JIANGSU BOYAN ELECTRONIC TECHNOLOGY CO LTD | 2014-12-24 | — | — | CN | claimed |
| WO-2014176217-A1 | BATTERY BINDER | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2014-10-30 | — | — | WO | claimed |
| US-20140312268-A1 | BATTERY BINDER | E I DU PONT DE NEMOURS AND COMPANY (US) | 2014-10-23 | — | — | US | claimed |
| CN-1291301-A | Positive active photodielectric composition | EASORA LAMINATED SYSTEM CO (US) | 2001-04-11 | — | — | CN | claimed |
| EP-0566780-B1 | Heat-resistant resin composition | KONISHI CO LTD (JP) | 1998-03-11 | — | — | EP | claimed |
| EP-0566780-A1 | Heat-resistant resin composition | KONISHI CO., LTD. (JP) | 1993-10-27 | — | — | EP | claimed |