SCHEMBL2236537

SCHEMBL2236537

CC1=C(C2=C3C(=O)OC(=O)C3CCCC2)CCCCC1

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL466450 0.81
SCHEMBL2238959 0.74 ALDH1A1 (0.35)
SCHEMBL2237386 0.74 ALDH1A1 (0.35)
SCHEMBL2237383 0.74 ALDH1A1 (0.35)
SCHEMBL31656195 0.67 ALDH1A1 (0.32)
SCHEMBL17195994 0.61 TLR4 (0.34) KMT2A
SCHEMBL7025876 0.60
SCHEMBL726600 0.60
SCHEMBL1595459 0.59 CTRB1 (0.49)
SCHEMBL14620427 0.59 CEL (0.33) KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119907845-A Adhesive, laminate and packaging material DIC株式会社 2025-04-29 CN disclosed
CN-114929778-B Polyester resin, lithographic ink composition, printed matter, and method for producing printed matter 阪田油墨股份有限公司 2024-12-17 CN disclosed
CN-119041651-A Polymer flooring and method for producing the same 埃克森美孚(惠州)化工有限公司 2024-11-29 CN disclosed
CN-118829674-A Epoxy resin, epoxy resin composition, and cured epoxy resin 日铁化学材料株式会社 2024-10-22 CN disclosed
CN-111378093-B Epoxy resin, method for producing same, epoxy resin composition, and epoxy resin cured product 日铁化学材料株式会社 2024-09-03 CN disclosed
CN-118591574-A Epoxy resin, polyhydroxyl resin, epoxy resin composition, cured epoxy resin, and process for producing polyhydroxyl resin 日铁化学材料株式会社 2024-09-03 CN disclosed
CN-111378094-B Epoxy resin, epoxy resin composition, and resin cured product 日铁化学材料株式会社 2024-08-20 CN disclosed
CN-111399339-B Oligomer, photosensitive resin composition containing same, photosensitive spacer and coating 达兴材料股份有限公司 2023-12-05 CN disclosed
CN-116848169-A Epoxy resin, method for producing the epoxy resin, epoxy resin composition using the epoxy resin, and cured product 日铁化学材料株式会社 2023-10-03 CN disclosed
CN-116761867-A Adhesive, laminate and packaging material DIC株式会社 2023-09-15 CN disclosed
CN-116529431-A Nonwoven fabric with improved touch and mechanical properties 埃克森美孚化学专利公司 2023-08-01 CN disclosed
CN-114929778-A Polyester resin, ink composition for offset printing, printed matter, and method for producing printed matter 阪田油墨股份有限公司 2022-08-19 CN disclosed
CN-113412297-A Resin composition for fiber-reinforced plastic and fiber-reinforced plastic containing the same 株式会社艾迪科 2021-09-17 CN disclosed
CN-108350146-B Epoxy resin composition containing long-chain alkylene group 日产化学工业株式会社 2021-03-16 CN disclosed
US-7988748-B2 Additive as component of mineral oil compositions LEUNA POLYMER GMBH (DE) 2011-08-02 US disclosed
US-7776801-B2 Additive mixture as component of a mineral oil composition LEUNA POLYMER GMBH (DE) 2010-08-17 US disclosed
US-20070219100-A1 Additive Mixture As Component Of A Mineral Oil Composition TAEUBERT HILTRUD 2007-09-20 US disclosed
US-20070180761-A1 Additive as component of mineral oil compositions LEUNA POLYMER GMBH (DE) 2007-08-09 US disclosed
US-20070130821-A1 Additive mixture as component of mineral oil compositions TAEUBERT HILTRUD 2007-06-14 US disclosed
US-5629379-A Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct HARPER JOHN D (US) 1997-05-13 US disclosed