SCHEMBL467594

SCHEMBL467594

CCO[SiH](COC(C)=O)OCC

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.52
LMNA P02545 1/20 0.52
HSD17B10 Q99714 1/20 0.52
TSHR P16473 1/20 0.43
GAA P10253 2/20 0.33
CHRM5 P08912 2/20 0.33
CHRM1 P11229 2/20 0.33
CHRM3 P20309 2/20 0.33
ALOX15 P16050 1/20 0.33
MGAM O43451 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33
PGR P06401 1/20 0.33
CHRM2 P08172 1/20 0.33
CHRM4 P08173 1/20 0.33
HTR1A P08908 1/20 0.33
CHRNB2 P17787 1/20 0.33
TBXA2R P21731 1/20 0.33
CHRNB4 P30926 1/20 0.33
CHRNA3 P32297 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2415583 0.82 ALDH1A1 (0.46) ALDH1A1LMNAHSD17B10TSHRGAA
SCHEMBL2581746 0.79 THRB (0.50) ALDH1A1LMNAHSD17B10TSHRGAA
SCHEMBL960530 0.77 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10TSHRGAA
SCHEMBL334203 0.76 CA12 (0.33)
SCHEMBL28144978 0.76 PRKCA (0.36) ALDH1A1LMNAHSD17B10GAAALOX15
SCHEMBL467911 0.75 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10TSHRGAA
Ethyl Acetate SCHEMBL27487837 0.73
SCHEMBL28056390 0.71 ALDH1A1 (0.40) ALDH1A1LMNAHSD17B10TSHR
SCHEMBL11576056 0.71 ALDH1A1 (0.50) ALDH1A1LMNAHSD17B10TSHRGAA
Ethyl Acetate SCHEMBL28583677 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024009957-A1 LIGHT/MOISTURE CURABLE RESIN COMPOSITION, CURED PRODUCT, USE OF LIGHT/MOISTURE CURABLE RESIN COMPOSITION, AND END FACE PROTECTION METHOD 積水化学工業株式会社 2024-01-11 WO disclosed
WO-2023176795-A1 LIGHT-MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENT, AND ADHESIVE AGENT FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-09-21 WO disclosed
WO-2023153514-A1 PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-08-17 WO disclosed
WO-2022260053-A1 PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, CURED BODY, AND ELECTRONIC COMPONENT 積水化学工業株式会社 2022-12-15 WO disclosed
EP-2604655-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2020-12-09 EP disclosed
WO-2020149379-A1 PHOTO/MOISTURE CURABLE RESIN COMPOSITION AND CURED BODY 積水化学工業株式会社 2020-07-23 WO disclosed
CN-107207870-B Curable composition and cured product thereof 株式会社钟化 2020-06-23 CN disclosed
EP-3246364-B1 CURABLE COMPOSITION AND CURED ARTICLE OBTAINED THEREFROM KANEKA CORP (JP) 2020-03-04 EP disclosed
US-10287399-B2 Curable composition and cured article obtained therefrom KANEKA CORPORATION (JP) 2019-05-14 US disclosed
US-RE46688-E1 Curable composition KANEKA CORPORATION (JP) 2018-01-30 US disclosed
US-8039142-B2 Battery case SONY CORPORATION (JP) 2011-10-18 US disclosed
WO-2011117072-A1 PRODUCTION OF SILAOXACYCLEN WACKER CHEMIE AG (DE) 2011-09-29 WO disclosed
WO-2011117071-A1 SILAOXACYCLEN WACKER CHEMIE AG (DE) 2011-09-29 WO disclosed
US-20110207886-A1 Method for Producing a-hereto-Substituted Alkylhalohydrosilane and Use Thereof KANEKA CORPORATION (JP) 2011-08-25 US disclosed
EP-2308884-A1 METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF Kaneka Corporation (JP) 2011-04-13 EP disclosed
US-20100151384-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2010-06-17 US disclosed
US-20090247712-A1 CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-10-01 US disclosed
EP-2080777-A1 HARDENING ORGANIC POLYMER, PROCESS FOR PRODUCING THE SAME, AND HARDENING COMPOSITION CONTAINING THE POLYMER Kaneka Corporation (JP) 2009-07-22 EP disclosed
US-20090050020-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2009-02-26 US disclosed
EP-1855159-A1 COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2007-11-14 EP disclosed