SCHEMBL4740071

SCHEMBL4740071

CCCCCCCC(CC(=O)O)C1CC2C=CC1C2

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 7/20 0.43
FFAR1 O14842 2/20 0.36
FFAR4 Q5NUL3 1/20 0.36
S1PR2 O95136 1/20 0.35
S1PR1 P21453 1/20 0.35
MAPT P10636 1/20 0.34
LCK P06239 1/20 0.34
PPARD Q03181 1/20 0.34
ZDHHC20 Q5W0Z9 1/20 0.34
ZDHHC2 Q9UIJ5 1/20 0.34
ALOX5 P09917 1/20 0.34
TBXA2R P21731 1/20 0.34
PTGFR P43088 1/20 0.34
PTGER2 P43116 1/20 0.34
KDM4E B2RXH2 1/20 0.34
MMP2 P08253 1/20 0.33
MMP9 P14780 1/20 0.33
MMP12 P39900 1/20 0.33
EPHX2 P34913 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2858536 0.75 ACE2 (0.42) GPR84FFAR1MAPTLCKPPARD
SCHEMBL16766420 0.74 TSHR (0.38) EPHX2
SCHEMBL14123967 0.71 LMNA (0.34)
SCHEMBL14123965 0.71 LMNA (0.34)
SCHEMBL2070938 0.71 KDM4E (0.41) KDM4EEPHX2
SCHEMBL957637 0.70 ACE2 (0.49) GPR84FFAR1FFAR4MAPTLCK
SCHEMBL31396475 0.70 KDM4E (0.34) KDM4E
SCHEMBL2040045 0.69 KDM4E (0.36) KDM4E
SCHEMBL29089252 0.69 ALDH1A1 (0.53) GPR84FFAR1FFAR4MAPTLCK
SCHEMBL8735267 0.68 ALDH1A1 (0.56) GPR84FFAR1FFAR4EPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080199805-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. 2008-08-21 US disclosed
WO-2008098189-A1 PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-14 WO disclosed