SCHEMBL475299

SCHEMBL475299

C=C(C)C(=O)NCOCCC

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.42
TSHR P16473 3/20 0.37
ACHE P22303 1/20 0.35
EPHX2 P34913 1/20 0.35
ALDH1A1 P00352 4/20 0.34
TGFBR1 P36897 1/20 0.33
CES2 O00748 1/20 0.31
HSD17B10 Q99714 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
MGAM O43451 1/20 0.30
GAA P10253 1/20 0.30
SI P14410 1/20 0.30
MGAM2 Q2M2H8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11120929 0.94 THRB (0.47) THRBTSHRACHEEPHX2ALDH1A1
SCHEMBL27019 0.88 TSHR (0.43) THRBTSHRACHEALDH1A1CES2
SCHEMBL2346839 0.87 ALDH1A1 (0.40) THRBTSHRALDH1A1TGFBR1HSD17B10
SCHEMBL1122853 0.86 TSHR (0.50) THRBTSHRACHEEPHX2CES2
SCHEMBL1123354 0.86 EPHX2 (0.44) THRBTSHRACHEEPHX2ALDH1A1
SCHEMBL150035 0.85 THRB (0.48) THRBTSHREPHX2ALDH1A1TGFBR1
SCHEMBL9353689 0.85 TSHR (0.53) THRBTSHRACHEEPHX2CES2
SCHEMBL2000921 0.85 TSHR (0.53) THRBTSHRACHEEPHX2CES2
SCHEMBL9353870 0.85 TSHR (0.53) THRBTSHRACHEEPHX2CES2
SCHEMBL1123160 0.85 TSHR (0.53) THRBTSHRACHEEPHX2CES2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 618 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114868298-B Composite stripping method Guangdong Haozhi Technology Co.,Ltd. (CN) 2026-05-26 CN claimed
EP-4169110-B1 METHOD FOR COMPOSITE DELAMINATION GRST SINGAPORE PTE LTD (SG) 2026-04-15 EP claimed
EP-4169106-B1 METHOD FOR COMPOSITE DELAMINATION GRST SINGAPORE PTE LTD (SG) 2026-04-01 EP claimed
EP-4169108-B1 METHOD FOR COMPOSITE DELAMINATION GRST SINGAPORE PTE LTD (SG) 2025-12-03 EP claimed
US-12401040-B2 Binder composition for secondary battery GRST SINGAPORE PTE. LTD. (SG) 2025-08-26 US claimed
CN-119916643-A Photosensitive resin composition, photosensitive dry film, cured film and circuit board 杭州福斯特电子材料有限公司 2025-05-02 CN claimed
US-20240413337-A1 Method of Preparing Cathode Slurry for Secondary Battery GRST SINGAPORE PTE. LTD. (SG) 2024-12-12 US claimed
CN-119108557-A Method for preparing cathode slurry of secondary battery 广东省皓智科技有限公司 2024-12-10 CN claimed
US-20240186517-A1 BINDER COMPOSITION FOR SECONDARY BATTERY GRST INTERNATIONAL LIMITED (CN) 2024-06-06 US claimed
CN-118099430-A Cathode for secondary battery and cathode slurry 广东省皓智科技有限公司 2024-05-28 CN claimed
WO-2009023103-A1 MULTI-LAYER IMAGEABLE ELEMENT WITH IMPROVED PROPERTIES EASTMAN KODAK COMPANY (US) 2009-02-19 WO claimed
US-7329694-B2 Ocular lens JOHNSON & JOHNSON VISION CARE, INC. (US) 2008-02-12 US claimed
US-7045269-B2 Method for forming images using negative working imageable elements EASTMAN KODAK COMPANY (US) 2006-05-16 US claimed
US-20040180291-A1 Method for forming images using negative working imageable elements CITICORP NORTH AMERICA, INC., AS AGENT 2004-09-16 US claimed
EP-0237312-B1 Active energy beam-curable resin composition CANON KK (JP) 1994-06-01 EP claimed
EP-0283990-B1 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO LTD (JP) 1994-01-26 EP claimed
US-5043363-A Active energy ray-curing resin composition CANON KABUSHIKI KAISHA (JP) 1991-08-27 US claimed
US-4996132-A Heat-resistant photosensitive resin composition TOYKO OHKA KOGYO CO. LTD. (JP) 1991-02-26 US claimed
EP-0283990-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-09-28 EP claimed
EP-0280295-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-08-31 EP claimed