SCHEMBL4780072

SCHEMBL4780072

NC(=O)C1C2C=CC(C2)C1C(=O)NOS(=O)(=O)C(F)(F)F

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.39
GAA P10253 2/20 0.39
CYP2C19 P33261 1/20 0.35
TDP1 Q9NUW8 2/20 0.33
KDM4E B2RXH2 2/20 0.33
POLB P06746 2/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
MEN1 O00255 1/20 0.33
NPC1 O15118 1/20 0.33
MAPT P10636 1/20 0.33
HPGD P15428 1/20 0.33
RAB9A P51151 1/20 0.33
KMT2A Q03164 1/20 0.33
NPSR1 Q6W5P4 1/20 0.32
TAAR1 Q96RJ0 1/20 0.32
CASP6 P55212 1/20 0.32
CTDSP1 Q9GZU7 1/20 0.32
HSD17B10 Q99714 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20377380 0.81 ALDH1A1 (0.38) ALDH1A1GAACYP2C19TDP1KDM4E
SCHEMBL29257254 0.79 ALDH1A1 (0.37) ALDH1A1GAACYP2C19TDP1POLB
SCHEMBL18334623 0.79
Trifluoromethanesulfonic Acid SCHEMBL16416686 0.78 ALDH1A1 (0.36) ALDH1A1GAACYP2C19TDP1KDM4E
SCHEMBL6918643 0.77 ENPP3 (0.41) ALDH1A1GAACYP2C19TDP1SMN1; SMN2
SCHEMBL4457037 0.77 ALDH1A1 (0.38) ALDH1A1GAATDP1KDM4EMEN1
SCHEMBL6568143 0.77 ALDH1A1 (0.36) ALDH1A1GAACYP2C19TDP1KDM4E
SCHEMBL5472080 0.76 ALDH1A1 (0.36) ALDH1A1GAACYP2C19TDP1MEN1
SCHEMBL24879875 0.73 ALDH1A1 (0.44) ALDH1A1GAATDP1KDM4EPOLB
SCHEMBL10717453 0.72 ALDH1A1 (0.36) ALDH1A1GAATDP1KDM4EPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118027277-B Acrylic ester polymer and preparation method and application thereof 广东粤港澳大湾区黄埔材料研究院 2024-06-11 CN disclosed
CN-118027277-A Acrylic ester polymer and preparation method and application thereof 广东粤港澳大湾区黄埔材料研究院 2024-05-14 CN disclosed
CN-110095941-B Photosensitive resin composition and method for producing semiconductor element 东丽株式会社 2023-02-17 CN disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
US-20200409261-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-12-31 US disclosed
US-10816898-B2 2020-10-27 US disclosed
US-20190056657-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2019-02-21 US disclosed
WO-2018033552-A1 COMPOSITION FOR BLACK MATRIX AND METHOD FOR PRODUCING BLACK MATRIX USING THE SAME AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L. (LU) 2018-02-22 WO disclosed
CN-103619892-B Phenolic resin and underlayer film forming material for lithography 三菱瓦斯化学株式会社 2016-08-24 CN disclosed
EP-3025197-A1 CROSS-LINKABLE FLUORINATED PHOTOPOLYMER Orthogonal Inc. (US) 2016-06-01 EP disclosed
WO-2015013396-A1 CROSS-LINKABLE FLUORINATED PHOTOPOLYMER ORTHOGONAL, INC. (US) 2015-01-29 WO disclosed
CN-102574963-B Aromatic hydrocarbon resin and underlayer film forming composition for lithography MITSUBISHI GAS CHEMICAL CO 2014-11-19 CN disclosed
CN-103619892-A Phenolic resin and underlayer film forming material for lithography MITSUBISHI GAS CHEMICAL CO 2014-03-05 CN disclosed
US-20080286693-A1 Sulfonate derivatives and the use thereof as latent acids MATSUMOTO AKIRA 2008-11-20 US disclosed
US-20040191674-A1 Chemical amplification resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-09-30 US disclosed
EP-1320785-A2 OXIME DERIVATIVES AND THE USE THEREOF AS LATENT ACIDS Ciba SC Holding AG (CH) 2003-06-25 EP disclosed
WO-2002025376-A2 OXIME DERIVATIVES AND THE USE THEREOF AS LATENT ACIDS CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 2002-03-28 WO disclosed
US-6014422-A Method for varying x-ray hybrid resist space dimensions INTERNAITONAL BUSINESS MACHINES CORPORATION (US) 2000-01-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20200409261-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD C9, C1R, RAD51 ALDH1A1 1553/4885GAA 4720/4885CYP2C19 1855/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R ALDH1A1 1540/4885GAA 4768/4885CYP2C19 1810/4885
US-20190056657-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD C9, C5, C1R ALDH1A1 1540/4885GAA 4768/4885CYP2C19 1810/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R ALDH1A1 1540/4885GAA 4768/4885CYP2C19 1810/4885
US-10816898-B2 C5, C9, H1-0 ALDH1A1 135/4885GAA 4420/4885CYP2C19 1427/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.