SCHEMBL4822306

SCHEMBL4822306

O=C=Nc1ccccc1S(=O)(=O)c1ccccc1N=C=O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 4/20 0.48
ALDH1A1 P00352 2/20 0.44
POLB P06746 1/20 0.44
GAA P10253 1/20 0.41
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
TRPA1 O75762 1/20 0.34
HTR6 P50406 2/20 0.32
HPGD P15428 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
GABRA1 P14867 1/20 0.32
GABRB2 P47870 1/20 0.32
CA1 P00915 2/20 0.31
CA2 P00918 2/20 0.31
CA4 P22748 2/20 0.31
CA6 P23280 2/20 0.31
CA12 O43570 1/20 0.31
CYP2C9 P11712 1/20 0.31
CA5A P35218 1/20 0.31
CA7 P43166 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1340781 0.88 HTR6 (0.48) CYP3A4ALDH1A1POLBGAAKMT2A
SCHEMBL9649794 0.84 CYP3A4 (0.39) CYP3A4ALDH1A1POLBKMT2ATRPA1
SCHEMBL31152409 0.83 CYP3A4 (0.45) CYP3A4ALDH1A1POLBGAATRPA1
SCHEMBL11044958 0.83 CYP3A4 (0.45) CYP3A4ALDH1A1POLBGAATRPA1
SCHEMBL10411478 0.83 CYP3A4 (0.50) CYP3A4ALDH1A1POLBTRPA1HPGD
SCHEMBL8678321 0.83 CYP3A4 (0.45) CYP3A4ALDH1A1POLBMEN1KMT2A
SCHEMBL4842516 0.83 CYP3A4 (0.45) CYP3A4ALDH1A1POLBGAATRPA1
SCHEMBL3412658 0.83 CA2 (0.47) CYP3A4ALDH1A1POLBCA1CA2
SCHEMBL1534409 0.82 CYP3A4 (0.44) CYP3A4ALDH1A1POLBTRPA1HPGD
SCHEMBL11117613 0.81 ALDH1A1 (0.66) CYP3A4ALDH1A1POLBGAAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4659797-A Matrix materials and a process for their preparation BAYER AKTIENGESELLSCHAFT (DE) 1987-04-21 US claimed
US-12071572-B2 Curable resin composition, use thereof, and production method thereof DAICEL-EVONIK LTD. (JP) 2024-08-27 US disclosed
US-12012534-B2 2024-06-18 US disclosed
US-12012532-B2 Curable resin composition, composite member, and production method therefor DAICEL-EVONIK LTD. (JP) 2024-06-18 US disclosed
US-20210222031-A1 CURABLE RESIN COMPOSITION, USE THEREOF, AND PRODUCTION METHOD THEREOF DAICEL-EVONIK LTD. (JP) 2021-07-22 US disclosed
US-20210198541-A1 CURABLE RESIN COMPOSITION, COMPOSITE MEMBER, AND PRODUCTION METHOD THEREFOR DAICEL-EVONIK LTD. (JP) 2021-07-01 US disclosed
CN-106631899-B A method of isocyanates is prepared using amine and carbonyl fluoride 北京宇极科技发展有限公司 2018-12-18 CN disclosed
EP-2902449-B1 CONDUCTIVE COMPOSITION AND CONDUCTIVE MOLDED BODY USING SAME MITSUBOSHI BELTING LTD (JP) 2018-09-19 EP disclosed
CN-106631899-A Method for preparing isocyanate by using amine and carbonyl fluoride 北京宇极科技发展有限公司 2017-05-10 CN disclosed
US-20150252224-A1 CONDUCTIVE COMPOSITION AND CONDUCTIVE MOLDED BODY USING SAME MITSUBOSHI BELTING LTD. (JP) 2015-09-10 US disclosed
EP-2902449-A1 CONDUCTIVE COMPOSITION AND CONDUCTIVE MOLDED BODY USING SAME Mitsuboshi Belting Ltd. (JP) 2015-08-05 EP disclosed
CN-104685002-A Conductive composition and conductive molded body using same MITSUBOSHI BELTING LTD 2015-06-03 CN disclosed
CN-100469803-C Photopolymerizable composition and flame-retardant resin-formed article FUJI XEROX CO LTD (JP) 2009-03-18 CN disclosed
US-7354958-B2 Photopolymerizable composition and flame-retardant resin-formed article FUJI XEROX CO., LTD. (JP) 2008-04-08 US disclosed
US-20060217479-A1 Photopolymerizable composition and flame-retardant resin-formed article FUJI XEROX CO., LTD. (JP) 2006-09-28 US disclosed
CN-1837248-A Photopolymerizable composition and flame-retardant resin-formed article FUJI XEROX CO LTD (JP) 2006-09-27 CN disclosed
US-5196531-A Poly(N-cyclic iminoether), process for production thereof, thermosetting composition containing it and thermoset resin TEIJIN LIMITED (JP) 1993-03-23 US disclosed
EP-0351814-A2 Poly (N-cyclic iminoether), processes for production thereof, thermosetting composition containing it and thermoset resin TEIJIN LIMITED (JP) 1990-01-24 EP disclosed