SCHEMBL482352

SCHEMBL482352

C[C]1C2CC3CC1CC(O)(C3)C2

nearest known ligand 0.33

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 7/20 0.33
GRIN2D O15399 1/20 0.32
GRIN3B O60391 1/20 0.32
GRIN1 Q05586 1/20 0.32
GRIN2A Q12879 1/20 0.32
GRIN2B Q13224 1/20 0.32
GRIN2C Q14957 1/20 0.32
GRIN3A Q8TCU5 1/20 0.32
PKM P14618 1/20 0.31
EPHX2 P34913 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12765792 0.78 EPHX2 (0.39) HSD11B1PKMEPHX2
Idramantone SCHEMBL12496957 0.76 EPHX2 (0.52) HSD11B1PKMEPHX2
Idramantone SCHEMBL12496961 0.76 EPHX2 (0.52) HSD11B1PKMEPHX2
Idramantone SCHEMBL3506711 0.76 EPHX2 (0.52) HSD11B1PKMEPHX2
Idramantone SCHEMBL61676 0.76 EPHX2 (0.52) HSD11B1PKMEPHX2
Idramantone SCHEMBL3506713 0.76 EPHX2 (0.52) HSD11B1PKMEPHX2
Idramantone SCHEMBL3506706 0.76 EPHX2 (0.52) HSD11B1PKMEPHX2
SCHEMBL13892543 0.76 PKM (0.31) PKMEPHX2
SCHEMBL28661222 0.76 EPHX2 (0.32) EPHX2
SCHEMBL8585061 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 250 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2202577-B1 Chemically amplified positive resist composition and resist patterning process SHINETSU CHEMICAL CO (JP) 2014-08-27 EP claimed
US-20240134280-A1 Polymer, Chemically Amplified Positive Resist Composition, Resist Patterning Process, And Mask Blank SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-04-25 US disclosed
US-20240118613-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-04-11 US disclosed
EP-4343433-A1 POLYMER, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, RESIST PATTERNING PROCESS, AND MASK BLANK SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-03-27 EP disclosed
CN-117736362-A Polymer, chemically amplified positive resist composition, resist pattern forming method, and blank mask 信越化学工业株式会社 2024-03-22 CN disclosed
EP-4336261-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-03-13 EP disclosed
CN-117666284-A Chemically amplified positive resist composition and method for forming resist pattern 信越化学工业株式会社 2024-03-08 CN disclosed
CN-117304425-A Dual cure method and system for fabricating 3D polymeric structures 浙江迅实科技有限公司 2023-12-29 CN disclosed
CN-117209694-A Dual cure method and system for fabricating 3D polymeric structures 浙江迅实科技有限公司 2023-12-12 CN disclosed
US-20230393470-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-07 US disclosed
US-20050106500-A1 Nitrogen-containing organic compound, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2005-05-19 US disclosed
US-20050095533-A1 Nitrogen-containing organic compound, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2005-05-05 US disclosed
US-20050008968-A1 Basic compound, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-01-13 US disclosed
US-20050003303-A1 Polymerizable ester having sulfonamide structure, polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-01-06 US disclosed
US-20040234884-A1 Basic compound, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-11-25 US disclosed
US-20040234885-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-11-25 US disclosed
US-20040176630-A1 Alicyclic methacrylate having oxygen substituent group on alpha-methyl SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-09-09 US disclosed
CN-1432873-A Acid generator, sulfonic acid derivative and radiation-sensitive resin composition JSR CORP (JP) 2003-07-30 CN disclosed
US-20030113658-A1 Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition JSR CORPORATION (JP) 2003-06-19 US disclosed
EP-1270553-A2 Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition JSR Corporation (JP) 2003-01-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20040176630-A1 Alicyclic methacrylate having oxygen substituent group on alpha-methyl DNMT3A, DNMT1, KDM2A HSD11B1 2999/4885GRIN2D 1242/4885GRIN3B 2936/4885
US-20030113658-A1 Acid generator, sulfonic acid, sulfonic acid derivatives and radiation-sensitive resin composition ASIC1, PFAS, RARA HSD11B1 3894/4885GRIN2D 1205/4885GRIN3B 3556/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.