SCHEMBL483356

SCHEMBL483356

O=C(c1ccccc1)N(CCCc1ccccc1)c1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(N(CCCc3ccccc3)C(=O)c3ccccc3)c2F)c1F

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ADRA2C P18825 1/20 0.37
PTGIR P43119 2/20 0.37
LPAR1 Q92633 6/20 0.33
LPAR5 Q9H1C0 1/20 0.33
LPAR2 Q9HBW0 1/20 0.32
NAMPT P43490 1/20 0.32
MEN1 O00255 1/20 0.32
LMNA P02545 1/20 0.32
POLB P06746 1/20 0.32
OPRM1 P35372 1/20 0.32
OPRD1 P41143 1/20 0.32
KMT2A Q03164 1/20 0.32
STAT3 P40763 1/20 0.32
MLYCD O95822 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL482918 0.90 MLYCD (0.37) ADRA2CLPAR1LPAR5MEN1POLB
SCHEMBL482952 0.90 NPC1 (0.35) ADRA2CSTAT3MLYCD
SCHEMBL483001 0.88 TSHR (0.37) MEN1KMT2A
SCHEMBL483360 0.88 MEN1 (0.36) LPAR1MEN1LMNAPOLBKMT2A
SCHEMBL483288 0.86 KMT2A (0.36) ADRA2CNAMPTMEN1OPRM1OPRD1
SCHEMBL482766 0.85 MLYCD (0.33) MEN1LMNAKMT2AMLYCD
SCHEMBL267593 0.84 LPAR1 (0.32) ADRA2CLPAR1LPAR5MLYCD
SCHEMBL482976 0.83 LPAR1 (0.32) LPAR1LPAR5
SCHEMBL482723 0.83 KMT2A (0.34) MEN1LMNAKMT2A
SCHEMBL599290 0.83 RAB9A (0.36) MEN1LMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
EP-1091247-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2001-04-11 EP disclosed
US-6153660-A VERY HIGH SENSITIVITY TO BEAMS IN THE VISIBLE REGION, PARTICULARLY TO VISIBLE RAYS AT 400 NM OR MORE SUCH AS RAYS AT 488 NM OR 532 NM CORRESPONDING TO THE OUTPUT OF AR+ LASER OR YAG-SHG LASER FUJI PHOTO FILM CO., LTD. (JP) 2000-11-28 US disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0949540-A1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJI PHOTO FILM CO., LTD (JP) 1999-10-13 EP disclosed
EP-0924570-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1999-06-23 EP disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed