Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.58 |
| ▸ | FAAH | O00519 | 5/20 | 0.56 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.46 |
| ▸ | PKM | P14618 | 1/20 | 0.46 |
| ▸ | HTT | P42858 | 1/20 | 0.46 |
| ▸ | ATM | Q13315 | 1/20 | 0.46 |
| ▸ | SRD5A2 | P31213 | 1/20 | 0.44 |
| ▸ | HPN | P05981 | 1/20 | 0.43 |
| ▸ | PARP1 | P09874 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29389066 | 1.00 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL486508 | 0.91 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29391803 | 0.91 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29391228 | 0.90 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL9491223 | 0.90 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL487151 | 0.90 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29754402 | 0.90 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL2944426 | 0.88 | MGLL (0.65) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL10693565 | 0.88 | MGLL (0.55) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29573151 | 0.88 | MGLL (0.65) | MGLLFAAHHSP90AA1ALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 138 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118256088-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-28 | — | — | CN | claimed |
| CN-118240341-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118240342-A | Thermosetting resin composition and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-116410594-B | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-116496199-A | Modified maleimide compound and application thereof | 广东生益科技股份有限公司 | 2023-07-28 | — | — | CN | claimed |
| CN-116410596-A | Resin composition and application thereof | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410595-A | Resin composition, prepreg comprising same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| CN-116410594-A | Resin composition, prepreg and metal foil-clad laminate | 广东生益科技股份有限公司 | 2023-07-11 | — | — | CN | claimed |
| EP-0372775-B1 | Thermosetting-resin-forming compositions | MITSUI TOATSU CHEMICALS (JP) | 1994-05-18 | — | — | EP | claimed |
| US-4968762-A | IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-11-06 | — | — | US | claimed |
| EP-0372775-A1 | Thermosetting-resin-forming compositions | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-06-13 | — | — | EP | claimed |
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| US-20250326893-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| WO-2025105439-A1 | CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105440-A1 | CURABLE COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MOLDED ARTICLE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| US-4831102-A | Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1989-05-16 | — | — | US | disclosed |
| EP-0294931-A1 | Self-lubricating thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-14 | — | — | EP | disclosed |
| EP-0294930-A1 | Thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-14 | — | — | EP | disclosed |
| EP-0288251-A1 | Thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-10-26 | — | — | EP | disclosed |
| EP-0253586-A1 | Thermosetting resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-01-20 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | CD79B, C1R, TGFBR1 | MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.