SCHEMBL2944426

SCHEMBL2944426

CCc1ccc(Oc2cccc(N3C(=O)C=CC3=O)c2)cc1

nearest known ligand 0.65

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
▸ MGLL Q99685 16/20 0.65
▸ FAAH O00519 5/20 0.51
▸ HSP90AA1 P07900 3/20 0.49
▸ ALDH1A1 P00352 1/20 0.44
▸ PKM P14618 1/20 0.44
▸ HTT P42858 1/20 0.44
▸ ATM Q13315 1/20 0.44
▸ HPN P05981 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29573151 1.00 MGLL (0.65) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL27846512 0.89 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29389066 0.88 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL486508 0.88 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL486546 0.88 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29391803 0.88 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL487151 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29391228 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL9491223 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL29754402 0.87 MGLL (0.70) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 — — CN claimed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN claimed
CN-118240341-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN claimed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 — — CN claimed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 — — CN claimed
CN-116410595-A Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 — — CN claimed
CN-116410594-A Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 — — CN claimed
CN-116410596-A Resin composition and application thereof 广东生益科技股份有限公司 2023-07-11 — — CN claimed
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 — — CN disclosed
CN-118240341-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN disclosed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 — — CN disclosed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 — — CN disclosed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 — — CN disclosed
CN-116410594-A Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 — — CN disclosed
US-20130338363-A1 SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND NIPPON SHOKUBAI CO., LTD. (JP) 2013-12-19 — — US disclosed
CN-102365310-B Thermosetting resin composition, and prepreg, insulating film with support, laminate, and printed wiring board using same HITACHI CHEMICAL CO LTD 2013-11-20 — — CN disclosed
US-8541532-B2 Silane compound, production method thereof, and resin composition containing silane compound NIPPON SHOKUBAI CO., LTD. (JP) 2013-09-24 — — US disclosed
CN-102365310-A Thermosetting resin composition, and prepreg, insulating film with support, laminate, and printed wiring board using same HITACHI CHEMICAL CO LTD 2012-02-29 — — CN disclosed
US-20100317774-A1 SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND NIPPON SHOKUBAI CO., LTD (JP) 2010-12-16 — — US disclosed
CN-1317329-C Resin composition, prepreg and laminate using the composition MITSUI CHEMICALS INC (JP) 2007-05-23 — — CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100317774-A1 SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND PIEZO1, ORAI2, ARID2 MGLL 4314/4885FAAH 2474/4885HSP90AA1 520/4885
US-20130338363-A1 SILANE COMPOUND, PRODUCTION METHOD THEREOF, AND RESIN COMPOSITION CONTAINING SILANE COMPOUND ZYX, NOX3, NOXO1 MGLL 3777/4885FAAH 3171/4885HSP90AA1 3572/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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