Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SIGMAR1 | Q99720 | 8/20 | 0.43 |
| ▸ | TAAR1 | Q96RJ0 | 2/20 | 0.43 |
| ▸ | SLC18A2 | Q05940 | 1/20 | 0.43 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.42 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23875151 | 0.90 | SIGMAR1 (0.50) | SIGMAR1SLC6A4HTT | |
| SCHEMBL9628206 | 0.90 | SIGMAR1 (0.50) | SIGMAR1SLC6A4HTT | |
| SCHEMBL15907606 | 0.90 | SIGMAR1 (0.59) | SIGMAR1TAAR1SLC18A2 | |
| SCHEMBL9627281 | 0.87 | HTT (0.57) | SIGMAR1TAAR1HTTSMN1; SMN2 | |
| SCHEMBL20019912 | 0.79 | TAAR1 (0.34) | SIGMAR1TAAR1SLC18A2SLC6A4 | |
| SCHEMBL487002 | 0.78 | TAAR1 (0.45) | SIGMAR1TAAR1SLC18A2SLC6A4HTT | |
| SCHEMBL21779818 | 0.78 | ALDH1A1 (0.49) | SIGMAR1TAAR1SLC18A2SLC6A4HTT | |
| SCHEMBL18182128 | 0.77 | OPRK1 (0.60) | SIGMAR1SLC6A4HTT | |
| SCHEMBL4958679 | 0.77 | TDP1 (0.56) | — | |
| SCHEMBL178505 | 0.76 | TAAR1 (0.63) | SIGMAR1TAAR1SLC18A2HTTSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11401381-B2 | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-08-02 | — | — | US | disclosed |
| EP-2412743-B1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | HITACHI CHEMICAL CO LTD (JP) | 2020-08-19 | — | — | EP | disclosed |
| US-10119047-B2 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-11-06 | — | — | US | disclosed |
| US-20150203715-A1 | Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same | RESONAC CORPORATION (JP) | 2015-07-23 | — | — | US | disclosed |
| US-20130330563-A1 | MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-12-12 | — | — | US | disclosed |
| EP-2666804-A1 | MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2013-11-27 | — | — | EP | disclosed |
| US-20120077401-A1 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-29 | — | — | US | disclosed |
| EP-2412743-A1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-02-01 | — | — | EP | disclosed |