SCHEMBL487002

SCHEMBL487002

CNC(C)CCCc1ccccc1CCCC(C)NC

nearest known ligand 0.45

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TAAR1 Q96RJ0 5/20 0.45
SIGMAR1 Q99720 4/20 0.45
SLC18A2 Q05940 1/20 0.45
CYP2C9 P11712 2/20 0.37
CYP2C19 P33261 2/20 0.37
CYP2D6 P10635 1/20 0.37
GFER P55789 1/20 0.37
SLC6A2 P23975 1/20 0.36
SLC6A4 P31645 1/20 0.36
SLC6A3 Q01959 1/20 0.36
ALDH1A1 P00352 1/20 0.35
CYP1A2 P05177 1/20 0.35
MEN1 O00255 1/20 0.35
HTT P42858 1/20 0.35
KMT2A Q03164 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
HPGD P15428 1/20 0.35
HTR2A P28223 1/20 0.34
HRH1 P35367 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9628209 0.87 MPO (0.49) TAAR1CYP2D6SLC6A4
SCHEMBL9627286 0.84 TAAR1 (0.50) TAAR1SIGMAR1
SCHEMBL15907606 0.82 SIGMAR1 (0.59) TAAR1SIGMAR1SLC18A2MEN1KMT2A
SCHEMBL487003 0.78 SIGMAR1 (0.43) TAAR1SIGMAR1SLC18A2SLC6A4HTT
SCHEMBL7637846 0.78 SLC6A2 (0.41) SLC6A2SLC6A4SLC6A3ALDH1A1MEN1
SCHEMBL17887872 0.77 TAAR1 (0.63) TAAR1SIGMAR1SLC18A2CYP2C9CYP2C19
SCHEMBL14463409 0.77 TAAR1 (0.63) TAAR1SIGMAR1SLC18A2CYP2C9CYP2C19
SCHEMBL178505 0.77 TAAR1 (0.63) TAAR1SIGMAR1SLC18A2CYP2C9CYP2C19
SCHEMBL17887713 0.76 TAAR1 (0.48) TAAR1SIGMAR1SLC18A2CYP2C9CYP2C19
SCHEMBL15947413 0.76 TAAR1 (0.48) TAAR1SIGMAR1SLC18A2CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11401381-B2 Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-08-02 US disclosed
EP-2412743-B1 THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME HITACHI CHEMICAL CO LTD (JP) 2020-08-19 EP disclosed
US-10119047-B2 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-11-06 US disclosed
US-20150203715-A1 Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same RESONAC CORPORATION (JP) 2015-07-23 US disclosed
US-20130330563-A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-12 US disclosed
EP-2666804-A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME Hitachi Chemical Co., Ltd. (JP) 2013-11-27 EP disclosed
US-20120077401-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-29 US disclosed
EP-2412743-A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME Hitachi Chemical Company, Ltd. (JP) 2012-02-01 EP disclosed