SCHEMBL4879779

SCHEMBL4879779

N#CCC(=S)N(Cc1ccc(Br)cc1)Cc1ccc(Br)cc1

nearest known ligand 0.40

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ PYCR1 P32322 7/20 0.40
▸ MAPK1 P28482 2/20 0.38
▸ TSHR P16473 1/20 0.38
▸ L3MBTL1 Q9Y468 1/20 0.38
▸ MAOB P27338 3/20 0.38
▸ MEN1 O00255 4/20 0.36
▸ KMT2A Q03164 4/20 0.36
▸ GAA P10253 1/20 0.36
▸ CYP19A1 P11511 1/20 0.35
▸ ALDH1A1 P00352 4/20 0.35
▸ SMN1; SMN2 Q16637 2/20 0.35
▸ LMNA P02545 1/20 0.34
▸ CTSK P43235 1/20 0.33
▸ KDM4E B2RXH2 1/20 0.33
▸ POLB P06746 1/20 0.33
▸ BLM P54132 1/20 0.33
▸ MAOA P21397 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4878087 0.83 ALDH1A1 (0.40) PYCR1KMT2AGAAALDH1A1SMN1; SMN2
SCHEMBL4879817 0.83 ALDH1A1 (0.41) PYCR1L3MBTL1MEN1KMT2AGAA
SCHEMBL4875642 0.79 ALDH1A1 (0.49) PYCR1MAPK1TSHRL3MBTL1MEN1
SCHEMBL7525500 0.67 TDP1 (0.40) PYCR1MAPK1TSHRL3MBTL1MAOB
SCHEMBL1875 0.64 MAOB (0.42) PYCR1L3MBTL1MAOBKMT2AKDM4E
SCHEMBL7051153 0.64 PYCR1 (0.48) PYCR1MAPK1MAOBALDH1A1KDM4E
SCHEMBL5703578 0.63 PYCR1 (0.58) PYCR1MAPK1TSHRL3MBTL1MAOB
SCHEMBL28269596 0.63 IDO1 (0.41) PYCR1MAOBMEN1KMT2AALDH1A1
SCHEMBL29083510 0.63 PYCR1 (0.64) PYCR1MAOBALDH1A1KDM4E
SCHEMBL7489893 0.62 MAOB (0.41) PYCR1L3MBTL1MAOBKMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080171440-A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate EBARA CORPORATION (JP) 2008-07-17 — — US disclosed
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