SCHEMBL4879817

SCHEMBL4879817

N#CCC(=S)N(Cc1ccc(Cl)cc1)Cc1ccc(Cl)cc1

nearest known ligand 0.41

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 4/20 0.41
▸ NPC1 O15118 1/20 0.41
▸ L3MBTL1 Q9Y468 1/20 0.41
▸ MAPT P10636 4/20 0.40
▸ PYCR1 P32322 1/20 0.38
▸ POLB P06746 5/20 0.37
▸ MEN1 O00255 4/20 0.37
▸ KMT2A Q03164 4/20 0.37
▸ SMN1; SMN2 Q16637 3/20 0.37
▸ LMNA P02545 1/20 0.37
▸ HTT P42858 1/20 0.37
▸ RAB9A P51151 1/20 0.37
▸ GAA P10253 2/20 0.36
▸ KDM4E B2RXH2 1/20 0.35
▸ NR1D1 P20393 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4878087 0.83 ALDH1A1 (0.40) ALDH1A1MAPTPYCR1POLBKMT2A
SCHEMBL4879779 0.83 PYCR1 (0.40) ALDH1A1L3MBTL1PYCR1POLBMEN1
SCHEMBL4875642 0.79 ALDH1A1 (0.49) ALDH1A1L3MBTL1MAPTPYCR1MEN1
SCHEMBL11496728 0.72 ALDH1A1 (0.46) ALDH1A1NPC1L3MBTL1MAPTPOLB
SCHEMBL14999782 0.71 ALDH1A1 (0.47) ALDH1A1NPC1L3MBTL1MAPTPOLB
SCHEMBL11496730 0.70 ALDH1A1 (0.43) ALDH1A1NPC1L3MBTL1MAPTPOLB
SCHEMBL22169240 0.70 ALDH1A1 (0.45) ALDH1A1NPC1L3MBTL1MAPTPYCR1
SCHEMBL11405433 0.67 ALDH1A1 (0.61) ALDH1A1L3MBTL1PYCR1POLBKMT2A
SCHEMBL6122081 0.66 ALDH1A1 (0.52) ALDH1A1NPC1L3MBTL1POLBMEN1
SCHEMBL710924 0.66 NPC1 (0.44) ALDH1A1NPC1L3MBTL1MAPTPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080171440-A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate EBARA CORPORATION (JP) 2008-07-17 — — US disclosed
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