SCHEMBL492236

SCHEMBL492236

O=C(O)C(C1=CCCC1)=C(C1=CCCC1)c1ccccc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 2/20 0.41
HDAC2 Q92769 2/20 0.41
HDAC8 Q9BY41 2/20 0.41
HDAC6 Q9UBN7 2/20 0.41
HDAC3 O15379 1/20 0.41
HDAC1 Q13547 1/20 0.41
HDAC7 Q8WUI4 1/20 0.41
HDAC5 Q9UQL6 1/20 0.41
CYP19A1 P11511 2/20 0.33
CES2 O00748 2/20 0.33
CES1 P23141 2/20 0.33
ALDH1A1 P00352 2/20 0.33
DAO P14920 1/20 0.33
TSHR P16473 1/20 0.33
NAPRT Q6XQN6 1/20 0.33
MCL1 Q07820 1/20 0.33
HPGD P15428 1/20 0.33
AKT1 P31749 1/20 0.32
MAPT P10636 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8939555 0.80 HDAC2 (0.54) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL8939554 0.80 HDAC2 (0.54) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL190197 0.79 HDAC2 (0.48) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL9066611 0.79 HDAC2 (0.48) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL190196 0.79 HDAC2 (0.48) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL8533642 0.77 ALDH1A1 (0.50) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL8394444 0.72 HDAC2 (0.50) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL810175 0.72 HDAC4 (0.48) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL18077380 0.70 CES2 (0.52) HDAC4HDAC2HDAC8HDAC6HDAC3
SCHEMBL36367 0.69 HDAC2 (0.47) HDAC4HDAC2HDAC8HDAC6HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160333215-A1 ACTIVATING ENERGY BEAM-CURABLE COMPOSITION FOR FLOORING MATERIAL DIC CORPORATION (JP) 2016-11-17 US disclosed
US-20160333131-A1 ACTIVE ENERGY RAY-CURABLE COMPOSITION FOR FLOORING MATERIALS AND INSTALLATION METHOD THEREFOR DIC CORPORATION (JP) 2016-11-17 US disclosed
EP-2007587-B1 INKJET RECORDING METHOD RICOH CO LTD (JP) 2013-07-24 EP disclosed
US-8399541-B2 Active energy ray-curable ink composition and printed matter DIC CORPORATION (JP) 2013-03-19 US disclosed
US-8142849-B2 Recording media, recording media-ink set, inkjet recording method and inkjet recording apparatus RICOH COMPANY, LTD. (JP) 2012-03-27 US disclosed
US-8104884-B2 Coating agent for UV curable inkjet printing MIMAKI ENGINEERING CO., LTD. (JP) 2012-01-31 US disclosed
US-20110221839-A1 COATING AGENT FOR UV CURABLE INKJET PRINTING MIMAKI ENGINEERING CO., LTD. (JP) 2011-09-15 US disclosed
EP-2064067-B1 INK JET RECORDING METHOD RICOH CO LTD (JP) 2011-06-08 EP disclosed
US-7938527-B2 Ink, ink cartridge, ink jet recording apparatus, and ink jet recording method RICOH COMPANY, LTD. (JP) 2011-05-10 US disclosed
US-20110014438-A1 ACTIVE ENERGY RAY-CURABLE INK COMPOSITION AND PRINTED MATTER DIC CORPORATION (JP) 2011-01-20 US disclosed
EP-1698647-A1 POLYMER AND PROCESS FOR PRODUCING POLYMER KANSAI PAINT CO., LTD. (JP) 2006-09-06 EP disclosed
EP-1398360-B1 RADIATION HARDENABLE ADHESIVE COMPOSITION CONTAINING DISPERSED NATURAL RUBBER FINE PARTICLES TOPPAN FORMS CO LTD (JP) 2006-08-16 EP disclosed
US-7081486-B2 Method of producing polymer SHIZUOKA UNIVERSITY (JP) 2006-07-25 US disclosed
EP-1598374-A1 METHOD OF PRODUCING POLYMER Japan as represented by President of Shizuoka University (JP) 2005-11-23 EP disclosed
US-20050143481-A1 Method of producing polymer KANSAI PAINT CO., LTD. (JP) 2005-06-30 US disclosed
US-20050080181-A1 Radiation hardenable adhesive composition containing dispersed natural rubber fine particles TOPPAN FORMS CO., LTD. (JP) 2005-04-14 US disclosed
EP-1398360-A1 RADIATION HARDENABLE ADHESIVE COMPOSITION CONTAINING DISPERSED NATURAL RUBBER FINE PARTICLES Toppan Forms Co., Ltd (JP) 2004-03-17 EP disclosed
EP-0427950-B1 A photosensitive resin composition for use in forming a relief structure ASAHI CHEMICAL IND (JP) 1996-07-17 EP disclosed
US-5336585-A Free of tunnel voids ASAHI KASEI KOGYO KABUSHIKI (JP) 1994-08-09 US disclosed
EP-0427950-A2 A photosensitive resin composition for use in forming a relief structure Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1991-05-22 EP disclosed