SCHEMBL4943546

SCHEMBL4943546

OCCOc1ccc(C(c2ccc(OCCO)cc2)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
ALDH1A1 P00352 2/20 0.50
RECQL P46063 1/20 0.50
ESR1 P03372 1/20 0.47
ESR2 Q92731 1/20 0.47
NR1I2 O75469 1/20 0.46
GAA P10253 1/20 0.43
PDK2 Q15119 1/20 0.41
KDM4E B2RXH2 1/20 0.38
MEN1 O00255 1/20 0.38
LMNA P02545 1/20 0.38
POLB P06746 1/20 0.38
KMT2A Q03164 1/20 0.38
LTA4H P09960 2/20 0.37
FFAR4 Q5NUL3 1/20 0.37
PTPRC P08575 1/20 0.37
PTPN2 P17706 1/20 0.37
PTPN1 P18031 1/20 0.37
PTPRB P23467 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17787262 0.95 CYP3A4 (0.50) CYP3A4SMN1; SMN2ALDH1A1RECQLESR1
SCHEMBL17787403 0.92 CYP3A4 (0.51) CYP3A4SMN1; SMN2ALDH1A1RECQLESR1
SCHEMBL3004341 0.91 ESR1 (0.45) CYP3A4SMN1; SMN2ALDH1A1RECQLESR1
SCHEMBL12214816 0.89 CYP3A4 (0.45) CYP3A4SMN1; SMN2ALDH1A1RECQLESR1
SCHEMBL26290184 0.84 ESR1 (0.50) CYP3A4SMN1; SMN2ALDH1A1ESR1ESR2
SCHEMBL584253 0.84 CYP3A4 (0.58) CYP3A4SMN1; SMN2ALDH1A1RECQLNR1I2
SCHEMBL10606350 0.84 CYP3A4 (0.62) CYP3A4SMN1; SMN2ALDH1A1RECQLNR1I2
SCHEMBL13310271 0.83 ALDH1A1 (0.44) CYP3A4SMN1; SMN2ALDH1A1RECQLGAA
SCHEMBL6333569 0.81 LTA4H (0.47) SMN1; SMN2ALDH1A1ESR1ESR2GAA
SCHEMBL8059890 0.81 SMN1; SMN2 (0.54) CYP3A4SMN1; SMN2ALDH1A1RECQLNR1I2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-1238553-A None JP disclosed
JP-4025527-A None JP disclosed
JP-4057826-A None JP disclosed
EP-2799464-B1 METHOD FOR CONTINUOUS PRODUCTION OF HIGH-MOLECULAR-WEIGHT POLYCARBONATE RESIN MITSUBISHI GAS CHEMICAL CO (JP) 2020-11-11 EP disclosed
EP-3070112-B1 METHOD FOR PRODUCING HIGH-MOLECULAR-WEIGHT AROMATIC POLYCARBONATE RESIN MITSUBISHI GAS CHEMICAL CO (JP) 2019-03-20 EP disclosed
US-9822218-B2 Process for producing a high molecular-weight aromatic polycarbonate resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-11-21 US disclosed
US-9822218-B2 Process for producing a high molecular-weight aromatic polycarbonate resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-11-21 US disclosed
EP-2674445-B1 PROCESS FOR MANUFACTURING BRANCHED AROMATIC POLYCARBONATE RESIN WITH DESIRED DEGREE OF BRANCHING MITSUBISHI GAS CHEMICAL CO (JP) 2017-10-11 EP disclosed
US-9701788-B2 Method for producing branched aromatic polycarbonate resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-07-11 US disclosed
US-9701788-B2 Method for producing branched aromatic polycarbonate resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-07-11 US disclosed
US-6077928-A Bis(dialkylmaleimide) derivative and polyetherimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-06-20 US disclosed
US-6031061-A Bis (triaklyltrimellitic anhydride) derivative and polyesterimide for optical communications formed therefrom SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-02-29 US disclosed
US-5959775-A COMPRISING RETROREFLECTIVE ELEMENTS (LENS) ENCAPSULATED IN SEALED CELLS SUPPORTED BY A BEAD BOND LAYER OF SEMINTERPENETRATING POLYMER 3M INNOVATIVE PROPERTIES COMPANY (US) 1999-09-28 US disclosed
WO-1999032908-A1 URETHANE/ACRYLATE BEAD BOND FOR RETROREFLECTIVE ARTICLES MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-07-01 WO disclosed
EP-0476822-B1 Energy curable pressure-sensitive compositions MINNESOTA MINING & MFG (US) 1997-03-05 EP disclosed
EP-0476822-A2 Energy curable pressure-sensitive compositions MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1992-03-25 EP disclosed
JP-H0457826-A FLUORO POLYCARBONATE RESIN CHISSO CORP 1992-02-25 JP disclosed
JP-H0425527-A FLUORINATED BICYCLOHEXYLENE POLYCARBONATE RESIN CHISSO CORP 1992-01-29 JP disclosed
US-4996291-A Wrapping material TOYO BOSEKI KABUSHIKI KAISHA (JP) 1991-02-26 US disclosed
JP-H01238553-A DIACRYLATE OR DIMETHACRYLATE HAVING FLUORINE-CONTAINING BISPHENOL GROUP AS SKELETON AND POLYMERIC MATERIAL COMPOSED OF SAID COMPOUND CENTRAL GLASS CO LTD 1989-09-22 JP disclosed