Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 7/20 | 0.56 |
| ▸ | MEN1 | O00255 | 6/20 | 0.56 |
| ▸ | KMT2A | Q03164 | 6/20 | 0.56 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.56 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.46 |
| ▸ | CASP1 | P29466 | 2/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.43 |
| ▸ | ATAD2 | Q6PL18 | 1/20 | 0.42 |
| ▸ | THRB | P10828 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 3/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 3/20 | 0.41 |
| ▸ | RAD52 | P43351 | 1/20 | 0.40 |
| ▸ | NPC1 | O15118 | 5/20 | 0.38 |
| ▸ | RAB9A | P51151 | 3/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.37 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22383909 | 0.94 | MAPT (0.51) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL17636557 | 0.80 | ALDH1A1 (0.52) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL10454214 | 0.80 | ALDH1A1 (0.50) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL11192658 | 0.76 | MEN1 (0.50) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL6519759 | 0.76 | MAPT (0.49) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL9624054 | 0.75 | L3MBTL1 (0.55) | MAPTMEN1KMT2AALDH1A1CYP3A4 | |
| SCHEMBL3343075 | 0.73 | ATAD2 (0.46) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL22593825 | 0.72 | ALKBH5 (0.36) | MAPTMEN1KMT2AKDM4ENPSR1 | |
| SCHEMBL11864269 | 0.72 | MEN1 (0.72) | MEN1KMT2ANPSR1ALDH1A1CASP1 | |
| SCHEMBL6522042 | 0.72 | MAPT (0.43) | MAPTMEN1KMT2AKDM4ENPSR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7470451-B2 | Binding agent component for surface coating agents with improved adhesive properties | HENKEL AG & CO. KGAA (DE) | 2008-12-30 | — | — | US | disclosed |
| US-20060247407-A1 | Polymers with urea groups and silyl groups and production and use thereof | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) | 2006-11-02 | — | — | US | disclosed |
| US-7057001-B2 | Polymers with urea groups and silyl groups and production and use thereof | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) (DE) | 2006-06-06 | — | — | US | disclosed |
| US-20050260401-A1 | Polymers with urea groups and silyl groups and production and use thereof | HENKEL AG & CO. KGAA (DE) | 2005-11-24 | — | — | US | disclosed |
| US-20050129955-A1 | Binding agent component for surface coating agents with improved adhesive properties | HENKEL AG & CO. KGAA (DE) | 2005-06-16 | — | — | US | disclosed |
| US-5705594-A | Polyamine crosslinking agent formulation and its preparation | BAYER AKTIENGESELLSCHAFT (DE) | 1998-01-06 | — | — | US | disclosed |
| EP-0274646-B1 | PROCESS FOR THE PREPARATION OF PREPREGS, AND THEIR USE | Siemens Nixdorf Informationssysteme Aktiengesellschaft (DE) | 1992-02-05 | — | — | EP | disclosed |
| US-4812490-A | POLYEPOXY RESIN, TRIAZINE HARDENER, MINERAL FILLER FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS | SIEMENS AKTIENGESELLSCHAFT (DE) | 1989-03-14 | — | — | US | disclosed |
| US-4783345-A | Method for the manufacture of prepregs and their use | SIEMENS AKTIENGESELLSCHAFT (DE) | 1988-11-08 | — | — | US | disclosed |
| EP-0274646-A1 | Process for the preparation of prepregs, and their use | Siemens Nixdorf Informationssysteme Aktiengesellschaft (DE) | 1988-07-20 | — | — | EP | disclosed |
| EP-0271772-A2 | Epoxy resin molding compounds | SIEMENS AKTIENGESELLSCHAFT (DE) | 1988-06-22 | — | — | EP | disclosed |
| US-4728697-A | DIELECTRIC COATINGS FOR METAL CONDUCTORS | GENERAL ELECTRIC COMPANY (US) | 1988-03-01 | — | — | US | disclosed |
| EP-0223958-A2 | Crosslinked copolyamideimides and method for their preparation | GENERAL ELECTRIC COMPANY (US) | 1987-06-03 | — | — | EP | disclosed |