SCHEMBL49842

SCHEMBL49842

COC(CCN)CCCN

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
GABBR2 O75899 1/20 0.31
GABBR1 Q9UBS5 1/20 0.31
NFKB1 P19838 1/20 0.30
HTR2A P28223 1/20 0.30
HRH1 P35367 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15282067 0.97 GABBR2 (0.30) GABBR2GABBR1
SCHEMBL8579934 0.92 NFKB1 (0.35) NFKB1
SCHEMBL6258110 0.85 DNM1 (0.36)
SCHEMBL10535146 0.84
SCHEMBL31314417 0.83 OPRM1 (0.41)
SCHEMBL13729177 0.82
SCHEMBL28028441 0.79 GABBR2 (0.31) GABBR2GABBR1
SCHEMBL11705995 0.79
SCHEMBL11516931 0.78
SCHEMBL4083558 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2274 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11905381-B2 Polyimide microparticles XEROX CORPORATION (US) 2024-02-20 US claimed
CN-112266612-B Resin composition, and preparation method and application thereof 苏州生益科技有限公司 2022-11-25 CN claimed
US-20220363843-A1 POLYIMIDE MICROPARTICLES XEROX CORPORATION (US) 2022-11-17 US claimed
EP-4089136-A1 POLYIMIDE MICROPARTICLES Xerox Corporation (US) 2022-11-16 EP claimed
CN-115322398-A Polyimide fine particles 施乐公司 2022-11-11 CN claimed
WO-2021113489-A1 POLYAMIC ACID VARNISH FROM HIGH PURITY BISPHENOL A DIANHYDRIDE AND ARTICLES PREPARED THEREFROM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2021-06-10 WO claimed
WO-2021113491-A1 POLYIMIDE VARNISH FROM HIGH PURITY BISPHENOL A DIANHYDRIDE AND ARTICLES PREPARED THEREFROM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2021-06-10 WO claimed
CN-112266612-A Resin composition, and preparation method and application thereof 苏州生益科技有限公司 2021-01-26 CN claimed
US-8545988-B2 Polyetherimide and polyetherimide sulfone blends having automotive lighting applications SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2013-10-01 US claimed
EP-1448672-B1 HIGH MOLECULAR WEIGHT POLY(IMIDE)S AND METHODS OF SYNTHESIS THEREOF SABIC INNOVATIVE PLASTICS IP (NL) 2012-12-26 EP claimed
US-20030125478-A1 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2003-07-03 US claimed
WO-2003050165-A1 METHODS FOR THE PREPARATION OF POLY(ETHERIMIDES)S GENERAL ELECTRIC COMPANY (US) 2003-06-19 WO claimed
EP-1318174-A1 Method of manufacture of polyester molding compositions and articles produced therefrom GENERAL ELECTRIC COMPANY (US) 2003-06-11 EP claimed
WO-2003040213-A1 HIGH MOLECULAR WEIGHT POLY(IMIDE)S AND METHODS OF SYNTHESIS THEREOF GENERAL ELECTRIC COMPANY (US) 2003-05-15 WO claimed
EP-1287076-A2 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES GENERAL ELECTRIC COMPANY (US) 2003-03-05 EP claimed
US-6500904-B1 FROM THE COUPLING OF LOWER MOLECULAR WEIGHT FUNCTIONALIZED PRECURSOR POLYIMIDES GENERAL ELECTRIC COMPANY 2002-12-31 US claimed
US-6498224-B1 SOLUTION POLYMERIZATION OF A DIANHYDRIDE AND A DIAMINE WHICH ELIMINATES THE NITRATION STEP; HIGH HEAT ENGINEERING PLASTICS GENERAL ELECTRIC COMPANY 2002-12-24 US claimed
WO-2001096477-A2 HIGH PERFORMANCE THERMOPLASTIC COMPOSITIONS WITH IMPROVED MELT FLOW PROPERTIES GENERAL ELECTRIC COMPANY (US) 2001-12-20 WO claimed
EP-0195402-B1 BIS(HYDROXYPHTHALIMIDE) AND PROCESS FOR PREPARING THE SAME, AND PROCESS FOR PREPARING POLYESTERIMIDE BY THE USE THEREOF NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-06-10 EP claimed
EP-0317943-A2 Polymers prepared from 4,4'-bis-[2-(3,4-(dicarboxyphenyl) hexafluoroisopropyl] diphenyl ether dianhydride HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed