SCHEMBL498564

SCHEMBL498564

COc1cc(/C=C/c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)cc(OC)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A1 P04798 8/20 0.55
CYP1B1 Q16678 8/20 0.55
CYP1A2 P05177 5/20 0.49
NQO2 P16083 6/20 0.47
ABL1 P00519 4/20 0.47
BCR P11274 4/20 0.47
ESR1 P03372 3/20 0.47
TTR P02766 3/20 0.47
ALOX5 P09917 3/20 0.47
ABCB1 P08183 2/20 0.47
CYP19A1 P11511 2/20 0.47
PTGS2 P35354 2/20 0.47
AHR P35869 2/20 0.47
TUBB4A P04350 1/20 0.47
TUBB P07437 1/20 0.47
TUBA3C P0DPH7 1/20 0.47
TUBA1B P68363 1/20 0.47
TUBA4A P68366 1/20 0.47
TUBB4B P68371 1/20 0.47
TUBB3 Q13509 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL498565 1.00 CYP1A1 (0.55) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL29447154 0.90 ESR1 (0.54) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL499043 0.90 ESR1 (0.54) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL499044 0.90 ESR1 (0.54) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL499390 0.88 AHR (0.49) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL499391 0.88 AHR (0.49) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL29447162 0.88 AHR (0.49) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL5185776 0.85 CYP1A1 (0.49) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL1130906 0.85 RELA (0.54) CYP1A1CYP1B1CYP1A2NQO2ABL1
SCHEMBL20450511 0.85 RELA (0.54) CYP1A1CYP1B1CYP1A2NQO2ABL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 193 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9244354-B2 Method for producing thick film photoresist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-01-26 US claimed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
US-20250271751-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2025-08-28 US disclosed
US-20250189895-A1 METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
US-20250172872-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-05-29 US disclosed
EP-3961676-B1 ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2025-01-22 EP disclosed
US-20240053680-A1 PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-15 US disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-20030032280-A1 Method for filling fine hole TOKYO OHKA KOGYO CO., LTD. (JP) 2003-02-13 US disclosed
US-20020182360-A1 Material for forming protective film TOKYO OHKA KOGYO CO., LTD. (JP) 2002-12-05 US disclosed
US-6388101-B1 METHACRYLIC ACID ESTER OF 3-HYDROXY-3-METHYL-1-OXACYCLOPENTAN-2-ONE TOKYO OHKA KOGYO CO., LTD. (JP) 2002-05-14 US disclosed
US-20020055064-A1 Anti-reflective coating composition, multilayer photoresist material using the same, and method for forming pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2002-05-09 US disclosed
US-6268108-B1 MIXTURE OF COMPOUND FORMING ACID UPON EXPOSURE OF ACTINIC RADIATION, COMPOUND CAPABLE OF CROSSLINKING, DYE AND SOLVENT TOKYO OHKA KOGYO CO., LTD. (JP) 2001-07-31 US disclosed
EP-1103856-A1 Positive resist composition & process for forming resist pattern using same Central Glass Company, Limited (JP) 2001-05-30 EP disclosed
US-6225476-B1 ACRYLIC ESTER COMPOUND HAVING ALKOXYCARBONYL GROUP OR GROUP DERIVED FROM MOLECULE OF LACTONE COMPOUND BY REMOVING HYDROGEN ATOM BONDED TO CARBON ATOM; MONOMER OF FILM-FORMING RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2001-05-01 US disclosed
US-6087063-A Positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-07-11 US disclosed
US-6042988-A ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION TOKYO OHKA KOGYO CO., LTD. (JP) 2000-03-28 US disclosed
US-5368783-A Novolak resin or polyhydroxystyrene resin, alkoxymethylated amino resin and triazine TOKYO OHKA KOGYO CO., LTD. (JP) 1994-11-29 US disclosed