SCHEMBL498765

SCHEMBL498765

COc1ccc(-c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)c(Br)c1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 5/20 0.42
SMN1; SMN2 Q16637 3/20 0.37
TP53 P04637 2/20 0.37
NFKB1 P19838 1/20 0.37
NFKB2 Q00653 1/20 0.37
RELA Q04206 1/20 0.37
CRHR1 P34998 1/20 0.37
HSP90AA1 P07900 1/20 0.35
HSP90AB1 P08238 1/20 0.35
CYP17A1 P05093 3/20 0.35
CYP11B1 P15538 3/20 0.35
CYP11B2 P19099 3/20 0.35
CYP1A2 P05177 2/20 0.34
CYP2A6 P11509 1/20 0.34
MEN1 O00255 5/20 0.34
KMT2A Q03164 5/20 0.34
RAB9A P51151 4/20 0.34
KDM4E B2RXH2 3/20 0.34
ALDH1A1 P00352 3/20 0.34
LMNA P02545 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8629869 0.84 ADORA3 (0.48) NPC1SMN1; SMN2TP53NFKB1NFKB2
SCHEMBL1063405 0.81 MAPT (0.32) NPC1SMN1; SMN2TP53NFKB1NFKB2
SCHEMBL30609978 0.81 MAPT (0.32) NPC1SMN1; SMN2TP53NFKB1NFKB2
SCHEMBL267816 0.79 NPC1 (0.38) NPC1SMN1; SMN2TP53CYP17A1CYP11B1
SCHEMBL29860079 0.79 NPC1 (0.38) NPC1SMN1; SMN2TP53CYP17A1CYP11B1
SCHEMBL3043757 0.77 CYP1A2 (0.41) NPC1CYP17A1CYP11B1CYP11B2CYP1A2
SCHEMBL6814557 0.77 NPC1 (0.38) NPC1SMN1; SMN2TP53HSP90AA1HSP90AB1
SCHEMBL482246 0.76 HSD17B1 (0.50) NPC1CYP17A1CYP11B1CYP11B2CYP1A2
SCHEMBL29860227 0.76 HSD17B1 (0.50) NPC1CYP17A1CYP11B1CYP11B2CYP1A2
SCHEMBL36116 0.75 CLK4 (0.48) NPC1SMN1; SMN2TP53CYP1A2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 282 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9244354-B2 Method for producing thick film photoresist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-01-26 US claimed
US-20240239922-A1 PHOTOCURABLE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-18 US disclosed
US-20240191003-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-06-13 US disclosed
US-20240192593-A1 PHOTOSENSITIVE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2024-06-13 US disclosed
US-20240166779-A1 PHOTOCURABLE COMPOSITION AND PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2024-05-23 US disclosed
US-20240158541-A1 PHOTOCURABLE COMPOSITION AND PATTERN-FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2024-05-16 US disclosed
US-11981794-B2 Curable composition, cured product, and compound TOKYO OHKA KOGYO CO., LTD. (JP) 2024-05-14 US disclosed
US-20240153687-A1 COMPOSITION HAVING MAGNETOSTRICTIVE PROPERTIES, AND CURED PRODUCT THEREOF TOHOKU UNIVERSITY (JP) 2024-05-09 US disclosed
US-20240141085-A1 PHOTOCURABLE LIQUID COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2024-05-02 US disclosed
US-20240103368-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION AND METHOD FOR PRODUCING HOLLOW STRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2024-03-28 US disclosed
US-6749994-B2 Photosensitive insulating paste composition and photosensitive film made therefrom TOKYO OHKA KOGYO CO., LTD. (JP) 2004-06-15 US disclosed
US-20030064319-A1 Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same TOKYO OHKA KOGYO CO., LTD. 2003-04-03 US disclosed
US-20030039921-A1 Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same TOKYO OHKA KOGYO CO., LTD. 2003-02-27 US disclosed
US-6506540-B2 Blend containing photoinitiators TOKYO OHKA KOGYO CO., LTD. (JP) 2003-01-14 US disclosed
US-20020164542-A1 Photosensitive insulating paste composition and photosensitive film made therefrom TOKYO OHKA KOGYO CO., LTD. (JP) 2002-11-07 US disclosed
US-20020031723-A1 Photopolymerizable composition TOKYO OHKA KOGYO CO., LTD. (JP) 2002-03-14 US disclosed
EP-1168080-A2 Photopolymerizable composition TOKYO OHKA KOGYO CO., LTD. (JP) 2002-01-02 EP disclosed
US-5908734-A SELECTIVELY EXPOSING A PHOTOSENSITIVE LAYER WITH A VISIBLE LASER BEAM, HEATING THE EXPOSED PHOTOSENSITIVE LAYER AT A TEMPERATURE OF FROM 36 TO 48.DEGREE. C. FOR 10 SECONDS TO 3 MINUTES, AND DEVELOPING THE PHOTOSENSITIVE LAYER. TOKYO OHKA KOGYO CO., LTD. (JP) 1999-06-01 US disclosed
US-5908720-A CARBON BLACK COATED WITH A RESIN OBTAINED FROM ONE OR MORE POLYMERIZABLE MONOMERS HAVING AT LEAST ONE REACTIVE GROUP SELECTED FROM THE GROUP CONSISTING OF EPOXY, THIOEPOXY, OXAZOLINE, AZILIDINE AND HYDROXYALKYL AMIDE GROUPS TOKYO OHKA KOGYO CO., LTD. (JP) 1999-06-01 US disclosed
US-5714286-A PHOTOPOLYMERIZABLE COMPOUND, PHOTOINITIATOR, LIGHT SHIELDING MATERIAL COMPOSED OF COPPER OXIDE AND IRON, MANGANESE, CHROMIUM, COBALT AND/OR NICKEL OXIDE TOKYO OHKA KOGYO CO., LTD. (JP) 1998-02-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240192593-A1 PHOTOSENSITIVE COMPOSITION PPOX, ERCC1, ERCC5 NPC1 4322/4885SMN1; SMN2 2829/4885TP53 2422/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.