Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GPR35 | Q9HC97 | 2/20 | 0.50 |
| ▸ | TSHR | P16473 | 3/20 | 0.46 |
| ▸ | MAOB | P27338 | 1/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.42 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | CTSD | P07339 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5604448 | 0.88 | MAOB (0.50) | GPR35TSHRMAOBTDP1ALDH1A1 | |
| SCHEMBL5490051 | 0.88 | GPR35 (0.47) | GPR35TSHRMAOBTDP1ALDH1A1 | |
| SCHEMBL286962 | 0.85 | MAOB (0.56) | TSHRMAOBALDH1A1HTTL3MBTL1 | |
| SCHEMBL11026110 | 0.84 | GPR35 (0.44) | GPR35TSHRMAOBALDH1A1HTT | |
| SCHEMBL11239213 | 0.84 | MAOB (0.44) | GPR35TSHRMAOBTDP1ALDH1A1 | |
| SCHEMBL2821427 | 0.83 | TSHR (0.52) | GPR35TSHRMAOBTDP1ALDH1A1 | |
| SCHEMBL11025870 | 0.83 | MAOB (0.46) | GPR35TSHRMAOBTDP1ALDH1A1 | |
| SCHEMBL15093078 | 0.82 | MAOB (0.42) | GPR35TSHRMAOBTDP1ALDH1A1 | |
| SCHEMBL17964396 | 0.81 | MAOB (0.41) | GPR35TSHRMAOBALDH1A1MEN1 | |
| SCHEMBL17964398 | 0.79 | MAOB (0.40) | GPR35TSHRMAOBALDH1A1MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 155 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4667537-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250382500-A1 | PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE | TOKYO OHKA KOGYO CO LTD (JP) | 2025-12-18 | — | — | US | disclosed |
| US-20250271751-A1 | PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250189895-A1 | METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-12 | — | — | US | disclosed |
| US-20250172872-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-05-29 | — | — | US | disclosed |
| CN-119620544-A | Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| CN-110317174-B | Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| CN-118829948-A | Method for manufacturing plating shaped article | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| CN-118742854-A | Chemically amplified positive photosensitive composition, method for producing molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2024-10-01 | — | — | CN | disclosed |
| US-20060141387-A1 | Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20060141386-A1 | Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20060141388-A1 | Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal | TOKYO OHKA KOGYO CO. LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| US-7063934-B2 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOYKO OHKA KOGYO CO., LTD. (JP) | 2006-06-20 | — | — | US | disclosed |
| US-20060035170-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | SAITO KOJI | 2006-02-16 | — | — | US | disclosed |
| US-20060035169-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2006-02-16 | — | — | US | disclosed |
| WO-2006003757-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |
| US-6838229-B2 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-04 | — | — | US | disclosed |
| US-20030064319-A1 | Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-04-03 | — | — | US | disclosed |
| US-20030039921-A1 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-02-27 | — | — | US | disclosed |