SCHEMBL500478

SCHEMBL500478

NN(C(=O)CCCCCCCCCCC(=O)N(N)C(=O)c1ccccc1)C(=O)c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 0.52
MAPT P10636 2/20 0.52
LMNA P02545 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
HDAC8 Q9BY41 5/20 0.47
HDAC1 Q13547 5/20 0.47
HDAC3 O15379 1/20 0.47
HDAC4 P56524 1/20 0.47
HDAC7 Q8WUI4 1/20 0.47
HDAC2 Q92769 1/20 0.47
HDAC10 Q969S8 1/20 0.47
HDAC11 Q96DB2 1/20 0.47
HDAC6 Q9UBN7 1/20 0.47
HDAC9 Q9UKV0 1/20 0.47
HDAC5 Q9UQL6 1/20 0.47
GAA P10253 1/20 0.44
ADRA2C P18825 1/20 0.44
CES2 O00748 1/20 0.42
CES1 P23141 1/20 0.42
ALOX5 P09917 3/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL813218 1.00 L3MBTL1 (0.52) L3MBTL1MAPTLMNATDP1HDAC8
SCHEMBL814104 1.00 L3MBTL1 (0.52) L3MBTL1MAPTLMNATDP1HDAC8
SCHEMBL815038 1.00 L3MBTL1 (0.52) L3MBTL1MAPTLMNATDP1HDAC8
SCHEMBL815273 0.98 L3MBTL1 (0.48) L3MBTL1MAPTLMNATDP1HDAC8
SCHEMBL3125344 0.92 CES2 (0.55) L3MBTL1MAPTLMNATDP1GAA
SCHEMBL813446 0.90 ADRA2C (0.43) L3MBTL1MAPTLMNATDP1ADRA2C
SCHEMBL29038470 0.89 HDAC1 (0.45) L3MBTL1MAPTLMNATDP1HDAC8
SCHEMBL27890698 0.87 L3MBTL1 (0.40) L3MBTL1MAPTLMNATDP1HDAC8
SCHEMBL6323030 0.85 NR4A2 (0.52) L3MBTL1MAPTLMNATDP1HDAC8
Sebacic Acid SCHEMBL448447 0.85 HDAC3 (0.61) L3MBTL1MAPTLMNATDP1HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8106112-B2 Biodegradable resin composition KAO CORPORATION (JP) 2012-01-31 US claimed
EP-3089472-B1 VIBRATION DAMPING MATERIAL KAO CORP (JP) 2018-10-31 EP disclosed
US-9721555-B2 Vibration damping material KAO CORPORATION (JP) 2017-08-01 US disclosed
EP-3089472-A1 VIBRATION DAMPING MATERIAL Kao Corporation (JP) 2016-11-02 EP disclosed
US-20160314776-A1 VIBRATION DAMPING MATERIAL KAO CORPORATION (JP) 2016-10-27 US disclosed
US-20140296399-A1 PROCESS FOR PRODUCTION OF POLYLACTIC ACID RESIN COMPOSITION KAO CORP (JP) 2014-10-02 US disclosed
US-8785520-B2 Process for production of polylactic acid resin composition KAO CORPORATION (JP) 2014-07-22 US disclosed
EP-2199052-B1 PROCESS FOR PRODUCTION OF INJECTION-MOLDED ARTICLE OF POLYLACTIC ACID RESIN KAO CORP (JP) 2014-01-22 EP disclosed
US-8481620-B2 Process for producing resin composition KAO CORPORATION (JP) 2013-07-09 US disclosed
EP-2345688-B1 PROCESS FOR PRODUCING RESIN COMPOSITION KAO CORP (JP) 2013-03-27 EP disclosed
US-20110124770-A1 BIODEGRADABLE RESIN COMPOSITION TAKENAKA AKIRA 2011-05-26 US disclosed
US-20100331446-A1 BIODEGRADABLE RESIN COMPOSITION TAKENAKA AKIRA 2010-12-30 US disclosed
US-7812066-B2 Biodegradable resin composition KAO CORPORATION (JP) 2010-10-12 US disclosed
US-20100210756-A1 BIODEGRADABLE RESIN COMPOSITION TAKENAKA AKIRA 2010-08-19 US disclosed
US-20100201037-A1 PROCESS FOR PRODUCTION OF INJECTION-MOLDED ARTICLE OF POLYLACTIC ACID RESIN KAO CORPORATION (JP) 2010-08-12 US disclosed
EP-2199052-A1 PROCESS FOR PRODUCTION OF INJECTION-MOLDED ARTICLE OF POLYLACTIC ACID RESIN Kao Corporation (JP) 2010-06-23 EP disclosed
US-20100063177-A1 BIODEGRADABLE RESIN COMPOSITION KAO CORPORATION (JP) 2010-03-11 US disclosed
EP-2067822-A1 BIODEGRADABLE RESIN COMPOSITION Kao Corporation (JP) 2009-06-10 EP disclosed
US-20090131601-A1 Biodegradable polyester resin composition, method for producing same, and molded body obtained by molding such composition UNITIKA LTD. (JP) 2009-05-21 US disclosed
EP-1889875-A1 BIODEGRADABLE POLYESTER RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED BODY OBTAINED BY MOLDING SUCH COMPOSITION Unitika Ltd. (JP) 2008-02-20 EP disclosed