SCHEMBL5033499

SCHEMBL5033499

C=Cc1cccc(OC2CCCCC2)c1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 2/20 0.40
MEF2D Q14814 2/20 0.40
TP53 P04637 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
HPGD P15428 1/20 0.38
PDK2 Q15119 2/20 0.38
KAT6A Q92794 1/20 0.38
TLR4 O00206 1/20 0.37
TLR2 O60603 1/20 0.37
OPRM1 P35372 1/20 0.36
OPRK1 P41145 1/20 0.36
KCNH2 Q12809 1/20 0.36
F2 P00734 1/20 0.36
PLG P00747 1/20 0.36
PLAU P00749 1/20 0.36
PLAT P00750 1/20 0.36
KLKB1 P03952 1/20 0.36
PRSS1 P07477 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15496944 0.98 HDAC4 (0.41) HDAC4MEF2DTP53TDP1MEN1
SCHEMBL29602592 0.84 F2 (0.42) TP53TDP1F2PRSS1HRH1
SCHEMBL2923227 0.83 HDAC4 (0.40) HDAC4MEF2DMEN1KMT2AHPGD
SCHEMBL676970 0.83 HDAC4 (0.40) HDAC4MEF2DMEN1KMT2AHPGD
SCHEMBL677449 0.83 HDAC4 (0.40) HDAC4MEF2DMEN1KMT2AHPGD
SCHEMBL3748275 0.83 SRC (0.46) HDAC4MEF2DTDP1MEN1KMT2A
SCHEMBL5744737 0.83 SRC (0.46) HDAC4MEF2DTDP1MEN1KMT2A
SCHEMBL11663045 0.82 SLC6A4 (0.47) MEN1KMT2APDK2KAT6AOPRM1
SCHEMBL676949 0.81 HDAC4 (0.41) HDAC4MEF2DMEN1KMT2APDK2
SCHEMBL3893959 0.81 SRC (0.47) HDAC4MEF2DTDP1KMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
US-20140065546-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-06 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-20060073411-A1 Chemically amplified resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-04-06 US disclosed
US-6900273-B1 Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part HITACHI CHEMICAL CO., LTD. (JP) 2005-05-31 US disclosed
US-20040220342-A1 Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part YAMASHITA YUKIHIKO (JP) 2004-11-04 US disclosed
US-20040191674-A1 Chemical amplification resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-09-30 US disclosed
US-6656660-B1 Resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-12-02 US disclosed
EP-1205517-A1 LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-05-15 EP disclosed
EP-1024406-A1 Resist composition WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 2000-08-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 HDAC4 885/4885MEF2D 2939/4885TP53 3368/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD HDAC4 1745/4885MEF2D 25/4885TP53 3077/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.