SCHEMBL5042495

SCHEMBL5042495

Nc1c(O)ccc(-c2ccc(O)c(N)c2C(F)(F)F)c1C(F)(F)F

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.37
MEN1 O00255 1/20 0.37
ALDH1A1 P00352 1/20 0.37
LMNA P02545 1/20 0.37
MAPT P10636 1/20 0.37
THRB P10828 1/20 0.37
PKM P14618 1/20 0.37
MAPK1 P28482 1/20 0.37
KMT2A Q03164 1/20 0.37
MCL1 Q07820 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
GLA P06280 1/20 0.35
GAA P10253 1/20 0.35
TSHR P16473 1/20 0.35
USP7 Q93009 1/20 0.35
ALOX5AP P20292 1/20 0.31
FEN1 P39748 1/20 0.31
NOTUM Q6P988 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7457763 0.82 ALDH1A1 (0.44) POLBMEN1ALDH1A1LMNAMAPT
SCHEMBL5508293 0.80 GLA (0.34) POLBMEN1ALDH1A1MAPTKMT2A
SCHEMBL1023977 0.78 NOTUM (0.44) ALDH1A1MAPK1NOTUM
SCHEMBL12955319 0.78 TSHR (0.39) POLBMEN1ALDH1A1MAPTPKM
SCHEMBL5042959 0.75 ALDH1A1 (0.33) MEN1ALDH1A1LMNAMAPTPKM
SCHEMBL1773087 0.75 ESR1 (0.33) POLBMEN1ALDH1A1MAPTKMT2A
SCHEMBL19765503 0.73 TRPA1 (0.39) ALDH1A1MAPTPKMMAPK1NPSR1
SCHEMBL5048208 0.73 GLA (0.35) POLBGLAGAATSHRUSP7
SCHEMBL5146822 0.72 NQO2 (0.37) POLBMEN1ALDH1A1LMNAMAPT
SCHEMBL5515872 0.71 GLA (0.34) POLBMEN1ALDH1A1MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7416822-B2 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2008-08-26 US disclosed
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
EP-1707588-A1 RESIN AND RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2006-10-04 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed