SCHEMBL506875

SCHEMBL506875

CCCCCCCCCC(CCCCCCCC)N=C=NCCCCCCCC

nearest known ligand 0.47

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.47
LMNA P02545 1/20 0.34
DNM1 Q05193 2/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
CA2 P00918 1/20 0.33
OPRM1 P35372 1/20 0.32
TSHR P16473 1/20 0.32
THRB P10828 1/20 0.32
GPR84 Q9NQS5 3/20 0.31
FDPS P14324 3/20 0.31
SPHK1 Q9NYA1 1/20 0.31
FFAR1 O14842 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL961380 0.85 LMNA (0.41) LMNADNM1CA2OPRM1TSHR
SCHEMBL30719360 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL29701322 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL28200189 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL18794899 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL17498715 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL5961880 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL6036230 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL1147300 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS
SCHEMBL28305252 0.79 NAAA (0.42) NAAALMNACA2GPR84FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 191 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260078256-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT POLYPLASTICS-EVONIK CORPORATION (JP) 2026-03-19 US disclosed
EP-4169977-B1 RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI CHEM CORP (JP) 2026-03-18 EP disclosed
US-12559623-B2 Resin composition and electromagnetic wave absorber MITSUBISHI CHEMICAL CORPORATION (JP) 2026-02-24 US disclosed
EP-4624533-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT Polyplastics-Evonik Corporation (JP) 2025-10-01 EP disclosed
CN-120153026-A Biodegradable polymer composition 巴斯夫欧洲公司 2025-06-13 CN disclosed
US-12312439-B2 Polybutylene terephthalate resin composition TOYOBO CO., LTD. (JP) 2025-05-27 US disclosed
CN-120005361-A Biodegradable resin composition and biodegradable molded article 爱思开利比奥有限公司 2025-05-16 CN disclosed
WO-2025094600-A1 RESIN COMPOSITION USING BIOMASS-RESOURCE-DERIVED POLYESTER ELASTOMER 東洋紡エムシー株式会社 2025-05-08 WO disclosed
WO-2025079453-A1 INJECTION MOLDED BODY, METHOD FOR PRODUCING INJECTION MOLDED BODY, AND MACHINE キヤノン株式会社 2025-04-17 WO disclosed
US-20250101222-A1 RESIN COMPOSITION FOR LASER LIGHT TRANSMISSION-SIDE MOLDED ARTICLE, AND MOLDED ARTICLE THEREOF POLYPLASTICS CO., LTD. (JP) 2025-03-27 US disclosed
US-20040242803-A1 Resin composition and molded article, film, and fiber each comprising the same TORAY INDUSTRIES, INC. (JP) 2004-12-02 US disclosed
EP-1445282-A1 RESIN COMPOSITION AND MOLDED ARTICLE FILM AND FIBER EACH COMPRISING THE SAME TORAY INDUSTRIES, INC. (JP) 2004-08-11 EP disclosed
CN-1076366-C Flame-retardant polyethylene terephthalate resin compositions KANEGAFUCHI CHEMICAL IND (JP) 2001-12-19 CN disclosed
CN-1072246-C Polyethylene terephthalate resin composition KANEGAFUCHI CHEMICAL IND (JP) 2001-10-03 CN disclosed
US-5886088-A A BLENDS OF MOLDING MATERIAL COMPRISING AN EPOXY COMPOUND OR RESIN AND A POLYFUNCTIONAL CARBODIIMIDE COMPOUND TO IMPROVE THE MOIST HEAT RESISTANCE, FLUIDITY AND MECHANICAL STRENGTH KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1999-03-23 US disclosed
US-5866672-A HALOGEN FLAME RETARDANT, EPOXY COMPOUNDS OR CARBODIIMIDE COMPOUNDS AND AN ANTIMONY COMPOUND KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1999-02-02 US disclosed
CN-1155894-A Polyethylene terephthalate resin composition KANEGAFUCHI CHEMICAL IND (JP) 1997-07-30 CN disclosed
CN-1153522-A Flame-retardant polyethylene terephthalate resin compositions KANEGAFUCHI CHEMICAL IND (JP) 1997-07-02 CN disclosed
EP-0764692-A1 POLYETHYLENE TEREPHTHALATE RESIN COMPOSITION KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1997-03-26 EP disclosed
EP-0763567-A1 FLAME-RETARDANT POLYETHYLENE TEREPHTHALATE RESIN COMPOSITIONS Kanegafuchi Kagaku Kogyo Kabushiki Kaisha (JP) 1997-03-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260078256-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT MACF1, GIGYF2, YIF1A NAAA 741/4885LMNA 2425/4885DNM1 1804/4885
US-12559623-B2 Resin composition and electromagnetic wave absorber TERB1, LBR, TEX10 NAAA 3375/4885LMNA 1702/4885DNM1 2814/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.