SCHEMBL51035

SCHEMBL51035

CCCc1ccc(O)c(Cc2cc(CCC)ccc2O)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CNR1 P21554 1/20 0.64
CNR2 P34972 1/20 0.64
ALOX5 P09917 2/20 0.59
BACE1 P56817 1/20 0.56
MAPT P10636 4/20 0.47
HIF1A Q16665 3/20 0.47
ALOX15 P16050 3/20 0.47
CYP3A4 P08684 2/20 0.47
LMNA P02545 2/20 0.47
HPGD P15428 2/20 0.47
BLM P54132 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
MEN1 O00255 1/20 0.47
SLC22A1 O15245 1/20 0.47
USP2 O75604 1/20 0.47
HSP90AA1 P07900 1/20 0.47
HSPD1 P10809 1/20 0.47
HSPA5 P11021 1/20 0.47
IDO1 P14902 1/20 0.47
ALOX12 P18054 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9913999 0.94 CNR1 (0.58) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL1346224 0.93 CNR1 (0.56) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL1345231 0.93 CNR1 (0.56) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL1345317 0.93 CNR1 (0.56) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL1345508 0.93 CNR1 (0.56) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL1343520 0.93 CNR1 (0.56) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL20673657 0.92 CNR1 (0.60) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL1021086 0.89 ALOX5 (0.71) CNR1CNR2ALOX5BACE1MAPT
SCHEMBL51066 0.88 NPC1 (0.55) CNR1CNR2ALOX5BACE1HIF1A
SCHEMBL1022604 0.88 BACE1 (0.72) CNR1CNR2ALOX5BACE1HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040225048-A1 Vibration damping material composition TITECS JAPAN CORPORATION (JP) 2004-11-11 US claimed
EP-1408075-A1 Vibration damping material composition Titecs Japan Corporation (JP) 2004-04-14 EP claimed
CN-119320326-B Method for preparing lignin-based aliphatic cyclic diamine by hydroamination of lignin-based aromatic diphenol 南京工业大学 2025-03-14 CN disclosed
CN-119320326-A Method for preparing lignin-based aliphatic cyclic diamine by hydroamination of lignin-based aromatic diphenol 南京工业大学 2025-01-17 CN disclosed
EP-2181853-B1 Thermosensitive recording medium JUJO PAPER CO LTD (JP) 2015-09-23 EP disclosed
EP-1724119-B1 DEVELOPER MIXTURE FOR THERMAL RECORDING MATERIALS AND THERMAL RECORDING MATERIALS MITSUBISHI CHEM CORP (JP) 2014-11-19 EP disclosed
US-8492308-B2 Thermosensitive recording medium NIPPON PAPER INDUSTRIES CO., LTD. (JP) 2013-07-23 US disclosed
EP-2479203-A1 AROMATIC POLYESTER Muroran Institute of Technology (JP) 2012-07-25 EP disclosed
US-20120172570-A1 AROMATIC POLYESTER NITTA CORPORATION 2012-07-05 US disclosed
US-8202821-B2 Thermal recording material NIPPON PAPER INDUSTRIES CO., LTD (JP) 2012-06-19 US disclosed
US-8129493-B2 Aromatic polyester MURORAN INSTITUTE OF TECHNOLOGY (JP) 2012-03-06 US disclosed
EP-1393923-B1 DEVELOPERS FOR THERMAL RECORDING MATERIALS AND THERMAL RECORDING MATERIALS API CORP (JP) 2009-08-12 EP disclosed
EP-2072274-A1 HEAT-SENSITIVE RECORDING MATERIAL Nippon Paper Industries CO., LTD. (JP) 2009-06-24 EP disclosed
US-20070173407-A1 Developer mixture for thermal recording materials and thermal recording materials API CORPORATION (JP) 2007-07-26 US disclosed
US-7141359-B2 Developers for thermal recording materials and thermal recording materials API CORPORATION (JP) 2006-11-28 US disclosed
EP-1724119-A1 DEVELOPER MIXTURE FOR THERMAL RECORDING MATERIALS AND THERMAL RECORDING MATERIALS API Corporation (JP) 2006-11-22 EP disclosed
US-20050118526-A1 Developers for thermal recording materials and thermal recording materials MITSUBISHI CHEMICAL CORPORATION (JP) 2005-06-02 US disclosed
US-20040225048-A1 Vibration damping material composition TITECS JAPAN CORPORATION (JP) 2004-11-11 US disclosed
EP-1408075-A1 Vibration damping material composition Titecs Japan Corporation (JP) 2004-04-14 EP disclosed
EP-1393923-A1 DEVELOPERS FOR THERMAL RECORDING MATERIALS AND THERMAL RECORDING MATERIALS API Corporation (JP) 2004-03-03 EP disclosed