Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 3/20 | 0.36 |
| ▸ | CA2 | P00918 | 3/20 | 0.36 |
| ▸ | CA12 | O43570 | 2/20 | 0.35 |
| ▸ | CA9 | Q16790 | 2/20 | 0.35 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.31 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | NAAA | Q02083 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3673090 | 1.00 | CA1 (0.36) | CA1CA2CA12CA9NPC1 | |
| SCHEMBL29212225 | 1.00 | CA1 (0.36) | CA1CA2CA12CA9NPC1 | |
| SCHEMBL29212226 | 1.00 | CA1 (0.36) | CA1CA2CA12CA9NPC1 | |
| SCHEMBL7941971 | 0.97 | CA1 (0.32) | CA1CA2CA12CA9 | |
| SCHEMBL9861657 | 0.83 | ACHE (0.31) | CA1CA2CA12CA9ACHE | |
| SCHEMBL13203294 | 0.83 | ALDH1A1 (0.42) | — | |
| SCHEMBL17014988 | 0.80 | CA1 (0.36) | CA1CA2CA12CA9NPC1 | |
| SCHEMBL3898721 | 0.79 | — | — | |
| SCHEMBL1553827 | 0.78 | CA1 (0.44) | CA1CA2CA12CA9NPC1 | |
| SCHEMBL9709468 | 0.77 | NAAA (0.35) | EPHX1NAAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 641 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119955369-A | Micro-LED laser massive transfer release material and preparation method and application thereof | 深圳市化讯半导体材料有限公司 | 2025-05-09 | — | — | CN | claimed |
| CN-119463770-A | Moisture-heat resistant single-component mercaptan epoxy adhesive | 苏州毫邦新材料有限公司 | 2025-02-18 | — | — | CN | claimed |
| CN-115286744-A | Resin capable of adsorbing aromatic aldehyde and synthesis method thereof | 烟台德邦科技股份有限公司 | 2022-11-04 | — | — | CN | claimed |
| CN-113004665-A | Antibacterial insect-preventing degradable agricultural mulching film and preparation method thereof | 华侨大学 | 2021-06-22 | — | — | CN | claimed |
| CN-112980167-A | Degradable agricultural mulching film and preparation method thereof | 华侨大学 | 2021-06-18 | — | — | CN | claimed |
| CN-111234125-A | Aldehyde-adsorbable VOC (volatile organic compound) resin and synthesis method thereof | 烟台德邦科技有限公司 | 2020-06-05 | — | — | CN | claimed |
| US-10381127-B2 | Saturated-dimer-acid-diester dielectric fluid | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-08-13 | — | — | US | claimed |
| US-10266641-B2 | Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material | TORAY INDUSTRIES, INC. (JP) | 2019-04-23 | — | — | US | claimed |
| CN-108992907-A | Protect shoulder protector | 深圳市思创新材科技有限公司 | 2018-12-14 | — | — | CN | claimed |
| CN-108720124-A | Protect knee-pad | 深圳市思创新材科技有限公司 | 2018-11-02 | — | — | CN | claimed |
| US-20030208008-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | RUBINSZTAJN MALGORZATA IWONA (US) | 2003-11-06 | — | — | US | claimed |
| US-6617400-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | claimed |
| US-6617401-B2 | Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device | GENERAL ELECTRIC COMPANY | 2003-09-09 | — | — | US | claimed |
| US-20030071367-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | claimed |
| US-20030071368-A1 | Epoxy resin compositions, solid state devices encapsulated therewith and method | GENERAL ELECTRIC COMPANY | 2003-04-17 | — | — | US | claimed |
| US-6507049-B1 | Encapsulants for solid state devices | GENERAL ELECTRIC COMPANY | 2003-01-14 | — | — | US | claimed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | claimed |
| US-6232426-B1 | BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER | AJINOMOTO CO., INC. (JP) | 2001-05-15 | — | — | US | claimed |
| US-4225483-A | Boric acid esters and oxetanes for stabilizing phosphite-free polycarbonates | BAYER AKTIENGESELLSCHAFT (DE) | 1980-09-30 | — | — | US | claimed |
| US-4155739-A | NONHYDROLYZING | TEXACO TRINIDAD, INC. (TT) | 1979-05-22 | — | — | US | claimed |