SCHEMBL5158779

SCHEMBL5158779

CCCCOC(Nc1nc(N)nc(-c2ccccc2)n1)(OCCCC)OCCCC

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.49
ADORA2A P29274 2/20 0.44
ADORA1 P30542 2/20 0.44
POLB P06746 1/20 0.44
ADORA3 P0DMS8 1/20 0.44
ADORA2B P29275 1/20 0.44
HSP90AA1 P07900 1/20 0.40
HSP90AB1 P08238 1/20 0.40
GPR68 Q15743 3/20 0.39
HTR1A P08908 1/20 0.39
IDH2 P48735 1/20 0.39
BCHE P06276 1/20 0.39
ACHE P22303 1/20 0.39
TLR8 Q9NR97 1/20 0.39
HRH4 Q9H3N8 1/20 0.39
TPH1 P17752 4/20 0.38
CHRNA7 P36544 1/20 0.37
ACP1 P24666 1/20 0.37
DHFR P00374 1/20 0.37
CDC7 O00311 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5157470 0.82 CDK1 (0.38) TLR8CDK1CDK2
SCHEMBL195901 0.80 NPSR1 (0.57) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL724229 0.79 NPSR1 (0.57) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL5156683 0.78 NPSR1 (0.49) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL8854656 0.76 HSD17B10 (0.35) TLR8CDK1CDK2
SCHEMBL4027047 0.76 NPSR1 (0.64) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL7981524 0.76 RAB9A (0.47) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL4363447 0.76 NPSR1 (0.47) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL5930165 0.75 NPSR1 (0.49) NPSR1ADORA2AADORA1POLBADORA3
SCHEMBL19579565 0.75 NPSR1 (0.62) NPSR1ADORA2AADORA1POLBADORA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115667404-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-05-03 CN disclosed
CN-117378044-A Polyimide-containing part forming composition, method for producing bonded body, method for producing device, and device 富士胶片株式会社 2024-01-09 CN disclosed
CN-117203746-A Method for manufacturing bonded body, method for manufacturing semiconductor device, and resin composition 富士胶片株式会社 2023-12-08 CN disclosed
EP-1057852-B1 Polyester film for decorative plate or decorative sheet MITSUBISHI POLYESTER FILM CORP (JP) 2007-02-14 EP disclosed
EP-0839856-B1 Polyester film for decorative plate or decorative sheet MITSUBISHI POLYESTER FILM CORP (JP) 2003-12-17 EP disclosed
EP-1057852-A2 Polyester film for decorative plate or decorative sheet Mitsubishi Polyester Film Corporation (JP) 2000-12-06 EP disclosed
US-6096410-A POLYESTER FILM FOR DECORATIVE PLATE OR HAS OPTICAL DENSITY OF 0.1 TO 5.0, A B VALUE OF NOT LESS THAN-0.5 AND LONGITUDINAL AND TRANSVERSE HEAT SHRINKAGE PERCENTAGES OF NOT LESS THAN -10.0% AND NOT MORE THAN +10.0% AFTER HEAT TREATMENT MITSUBISHI POLYESTER FILM CORPORATION (JP) 2000-08-01 US disclosed
US-5932320-A Polyester film for decorative plate or decorative sheet MITSUBISHI POLYESTER FILM CORPORATION (JP) 1999-08-03 US disclosed
EP-0839856-A2 Polyester film for decorative plate or decorative sheet Mitsubishi Polyester Film Corporation (JP) 1998-05-06 EP disclosed