SCHEMBL5162284

SCHEMBL5162284

Nc1ccc(-c2cccc3c2C(c2ccc(N)c(Cl)c2)c2ccccc2-3)cc1Cl

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.42
CYP3A4 P08684 3/20 0.42
ALDH1A1 P00352 1/20 0.42
MAPK1 P28482 1/20 0.42
ESR2 Q92731 1/20 0.37
EDNRB P24530 1/20 0.32
EDNRA P25101 1/20 0.32
ADORA1 P30542 2/20 0.32
CHRM3 P20309 1/20 0.32
CYBB P04839 1/20 0.32
NOX5 Q96PH1 1/20 0.32
SLC6A2 P23975 2/20 0.32
SLC6A4 P31645 2/20 0.32
SLC6A3 Q01959 2/20 0.32
BACE1 P56817 1/20 0.31
JAK2 O60674 1/20 0.31
JAK1 P23458 1/20 0.31
TYK2 P29597 1/20 0.31
JAK3 P52333 1/20 0.31
ADORA2A P29274 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7919928 0.81 CYP3A4 (0.43) TSHRCYP3A4ALDH1A1MAPK1EDNRB
SCHEMBL1372573 0.78 ALOX15 (0.45) TSHRALDH1A1MAPK1ESR2
SCHEMBL1300021 0.75 ALDH1A1 (0.61) TSHRCYP3A4ALDH1A1MAPK1ESR2
SCHEMBL30293297 0.75 TSHR (0.67) TSHRCYP3A4ALDH1A1MAPK1ESR2
SCHEMBL1034459 0.74 HSD17B10 (0.38) CYP3A4ALDH1A1
SCHEMBL22453138 0.71 TSHR (0.61) TSHRCYP3A4ALDH1A1MAPK1ESR2
SCHEMBL5717482 0.71 TLR8 (0.44) CYP3A4ESR2EDNRBEDNRA
SCHEMBL4631137 0.71 HSD17B1 (0.43) ALDH1A1EDNRBEDNRABACE1
SCHEMBL27967593 0.71 KMT2A (0.45) ALDH1A1MAPK1EDNRBEDNRASLC6A2
SCHEMBL573085 0.70 KMT2A (0.47) ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1407463-A2 CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES 3M Innovative Properties Company (US) 2004-04-14 EP claimed
US-6577492-B2 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer 3M INNOVATIVE PROPERTIES COMPANY 2003-06-10 US claimed
US-20030030966-A1 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes 3M INNOVATIVE PROPERTIES COMPANY 2003-02-13 US claimed
WO-2003007319-A2 CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES 3M INNOVATIVE PROPERTIES COMPANY (US) 2003-01-23 WO claimed
US-11123936-B2 Resin infusion process for manufacturing fiber-reinforced composites CYTEC INDUSTRIES INC. (US) 2021-09-21 US disclosed
EP-3233438-B1 MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION CYTEC IND INC (US) 2021-02-17 EP disclosed
US-10682791-B2 Modified resin systems suitable for liquid resin infusion CYTEC INDUSTRIES INC. (US) 2020-06-16 US disclosed
EP-3390023-B1 RESIN INFUSION PROCESS FOR MANUFACTURING FIBER-REINFORCED COMPOSITES CYTEC IND INC (US) 2019-11-06 EP disclosed
US-20190176377-A1 MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION CYTEC INDUSTRIES INC. (US) 2019-06-13 US disclosed
US-10245764-B2 Modified resin systems suitable for liquid resin infusion CYTEC INDUSTRIES INC. (US) 2019-04-02 US disclosed
EP-3390023-A1 RESIN INFUSION PROCESS FOR MANUFACTURING FIBER-REINFORCED COMPOSITES Cytec Industries Inc. (US) 2018-10-24 EP disclosed
US-20180272628-A1 RESIN INFUSION PROCESS FOR MANUFACTURING FIBER-REINFORCED COMPOSITES CYTEC INDUSTRIES INC. 2018-09-27 US disclosed
WO-2016100365-A1 MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION CYTEC INDUSTRIES, INC. (US) 2016-06-23 WO disclosed
EP-1407463-B1 ELECTRICAL ARTICLE HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES 3M INNOVATIVE PROPERTIES CO (US) 2007-02-28 EP disclosed
EP-1407463-A2 CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES 3M Innovative Properties Company (US) 2004-04-14 EP disclosed
EP-0826017-B1 CURABLE RESIN SOLS MINNESOTA MINING & MFG (US) 2004-03-31 EP disclosed
US-6577492-B2 Use of 9,9-bis(aminophenyl)fluorene curing agents reduces water adsorption in the dielectric layer 3M INNOVATIVE PROPERTIES COMPANY 2003-06-10 US disclosed
US-20030030966-A1 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes 3M INNOVATIVE PROPERTIES COMPANY 2003-02-13 US disclosed
WO-2003007319-A2 CAPACITOR HAVING EPOXY DIELECTRIC LAYER CURED WITH AMINOPHENYLFLUORENES 3M INNOVATIVE PROPERTIES COMPANY (US) 2003-01-23 WO disclosed
US-5648407-A Curable resin sols and fiber-reinforced composites derived therefrom MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-07-15 US disclosed